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专利名称：Method for measuring terminal flatness发明人：木村 昌義申请号：JP2018049623申请日：20180316公开号：JP2019158826A公开日：20190919
专利附图：
摘要：Problem to be solved: to provide a terminal flatness measuring methodcapable of inlining the manufacturing line and suppressing the reduction in measurementaccuracy. Terminal flatness measurement methodWhen the tip 11a of the plurality ofterminals 11 formed on the first substrate surface 10a of the module substrate 1 is
parallel to the first substrate surface 10a,A terminal flatness measuring method formeasuring the flatness of terminalA jig arrangement step for arranging a plurality of jigs3 spaced apart horizontally at a distance longer than the length of the first substratesurfaceThe mounting process of placing the module substrate 1 on the jig 3 with the firstsubstrate surface 10a vertically upwardly andA three-dimensional shape measuringprocess for measuring the three-dimensional shape of the terminal 11 in a non-contactstate from the upper and lower sides of the module substrate 1 andThe flatnesscalculation process for calculating the flatness of the terminal 11 based on the three-dimensional shape andIncludingThe loading process isThe tip portion 11a of the terminal11 is placed on the jig 3.Diagram
申请人：ＦＤＫ株式会社
地址：東京都港区港南一丁目６番４１号
国籍：JP
代理人：長門 侃二
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