专利内容由知识产权出版社提供
专利名称：Tape expansion device发明人：松田 智人申请号：JP2017110739申请日：20170605公开号：JP2018206947A公开日：20181227
专利附图：
摘要：Problem to be solved: to provide a tape expansion device capable of easilybreaking the electrostatic force generated when the expansion tape is expanded and thedie attach film can be easily removed. A tape expansion device which breaks along adividing schedule line in a state where a plurality of split scheduled lines attached to theback surface of a wafer set on the surface of the die attach film are affixed to anexpansion tape attached to an opening of an annular frame, and an annular frame Aframe holding unit for holding a m, a tape expansion unit in contact with an expansion
tape to extend an expansion tape, and a frame holding unit and a tape expansion unitAburner and a cold air introduction unit for introducing cooling dry air into the chamber aschill and an ionized air supply unit installed inside the chamber and supplying ionized air.Diagram
申请人：株式会社ディスコ
地址：東京都大田区大森北二丁目１３番１１号
国籍：JP
代理人：松本 昂,岡本 知広,笠原 崇廣
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