MMBF5434MMBF5434N-Channel Switch•This device is designed for digital switching applications where very low on resistance is mandatory.•Sourced from Process 58.321SuperSOT-3Marking: 61Z1. Drain 2. Source 3. GateAbsolute Maximum Ratings * TA=25°C unless otherwise notedSymbolVDGVGSIGFTJ, TstgDrain-Gate VoltageGate-Source VoltageForward Gate CurrentOperating and Storage Junction Temperature RangeParameterValue25-2510-55 ~ +150UnitsVVmA°C* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.NOTES:1)These ratings are based on a maximum junction temperature of 150 degrees C.2)These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.Electrical Characteristics TA=25°C unless otherwise notedSymbolParameterTest ConditionIG = -1.0µA, VDS = 0VGS = -15V, VDS = 0VDS = 5.0V, ID = 3.0nAVDS = 5.0, VGS = -10V VDS = 15V, IGS = 0 VDS = 0, ID = 10mA VDS = 0, VGS = 10V, f = 1.0MHzVDS = 0, VGS = 10V, f = 1.0MHz30103015-1.0Min.-25200-4.0200 Max.UnitsVnAVpAmAΩpFpFOff CharacteristicsGate-Source Breakdwon VoltageV(BR)GSSIGSSVGS(off) ID(off) IDSSrDS(on)CissCrssGate Reverse CurrentGate-Source Cutoff VoltageDrain Cutoff VoltagZero-Gate Voltage Drain Current *Drain-Source On ResistanceInput CapacitanceReverse Transfer CapacitanceOn CharacteristicsSmall Signal Characteristics* Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2.0%©2003 Fairchild Semiconductor CorporationRev. A, February 2003
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MMBF5434Thermal Characteristics TA=25°C unless otherwise noted
SymbolPDRθJCRθJA
Parameter
Total Device DissipationDerate above 25°C
Thermal Resistance, Junction to CaseThermal Resistance, Junction to Ambient
556Max.3502.8
UnitsmWmW/°C°C/W°C/W
* Device mounted on FR-4 PCB 1.6” × 1.6” × 0.06\"
©2003 Fairchild Semiconductor CorporationRev. A, February 2003
http://oneic.com/
MMBF5434Package DimensionsSuperSOT-3Dimensions in Millimeters©2003 Fairchild Semiconductor Corporation
Rev. A, February 2003
http://oneic.com/
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTORCORPORATION.As used herein:
1. Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into the body,or (b) support or sustain life, or (c) whose failure to performwhen properly used in accordance with instructions for useprovided in the labeling, can be reasonably expected toresult in significant injury to the user.
2. A critical component is any component of a life supportdevice or system whose failure to perform can bereasonably expected to cause the failure of the life supportdevice or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONSDefinition of Terms
Datasheet IdentificationAdvance Information
Product StatusFormative or In DesignFirst Production
Definition
This datasheet contains the design specifications forproduct development. Specifications may change inany manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.Fairchild Semiconductor reserves the right to makechanges at any time without notice in order to improvedesign.
This datasheet contains final specifications. FairchildSemiconductor reserves the right to make changes atany time without notice in order to improve design.This datasheet contains specifications on a productthat has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.
Preliminary
No Identification NeededFull Production
ObsoleteNot In Production
©2003 Fairchild Semiconductor CorporationRev. I2
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