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专利名称：RTM MOLDING METHOD AND DEVICE发明人：SEKIDO, Toshihide,IWASAWA, Shigeo,SENBA,
Tatsuya
申请号：EP05719166.0申请日：20050216公开号：EP1721719B1公开日：20141001
摘要：An RTM molding method comprising disposing a reinforcing fiber substrate in acavity of a mold consisting of a plurality of dies, clamping the mold, and thereafterinjecting resin to complete molding, characterized in that divided areas with respect tothe surface direction of the reinforcing fiber substrate are assumed, each divided area isone in which injected resin expands over the entire surface in the area and can be
substantially uniformly impregnated in the thickness direction of the substrate, and resinintroducing paths are formed for respective assumed divided areas for introducing theinjected resin into the respective divided areas; and an RTM molding device. When arelatively large molded product is to be molded, a molding step from resin injection toimpregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby enabling a high-quality molded product to be produced free fromvoids, etc., with a molding time shortened and production speed and volume increased.
申请人：TORAY INDUSTRIES
地址：JP
国籍：JP
代理机构：Webster, Jeremy Mark
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