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专利名称：Embedded semiconductor device package
and method of manufacturing thereof
发明人：Shakti Singh Chauhan,Paul Alan
McConnelee,Arun Virupaksha Gowda
申请号：US14844515申请日：20150903公开号：US09391027B2公开日：20160712
专利附图：
摘要：A package structure includes a dielectric layer, at least one semiconductordevice attached to the dielectric layer, one or more dielectric sheets applied to the
dielectric layer and about the semiconductor device(s) to embed the semiconductordevice(s) therein, and a plurality of vias formed to the semiconductor device(s) that areformed in at least one of the dielectric layer and the one or more dielectric sheets. Thepackage structure also includes metal interconnects formed in the vias and on one ormore outward facing surfaces of the package structure to form electrical
interconnections to the semiconductor device(s). The dielectric layer is composed of amaterial that does not flow during a lamination process and each of the one or moredielectric sheets is composed of a curable material configured to melt and flow whencured during the lamination process so as to fill-in any air gaps around the semiconductordevice(s).
申请人：General Electric Company
地址：Schenectady NY US
国籍：US
代理机构：Ziolkowski Patent Solutions Group, SC
代理人：Jean K. Testa
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