专利内容由知识产权出版社提供
专利名称：METHOD OF FABRICATING PRINTHEAD
INTEGRATED CIRCUIT WITH BACKSIDEELECTRICAL CONNECTIONS
发明人：Gregory John McAvoy,Rónán Pádraig Seán
O'Reilly,David McLeod Johnstone,KiaSilverbrook
申请号：US12509491申请日：20090727
公开号：US20110020965A1公开日：20110127
专利附图：
摘要：A method of fabricating a printhead integrated circuit configured for backsideelectrical connections. The method comprises the steps of: (a) providing a wafercomprising a plurality of partially-fabricated nozzle assemblies on a frontside of thewafer and through-silicon connectors extending from the frontside towards a backside ofthe wafer; (b) depositing a conductive layer on the frontside of said wafer and etching toform an actuator for each nozzle assembly and a frontside contact pad over a head ofeach through-silicon connector; (c) performing further MEMS processing steps to
complete formation of nozzle assemblies ink supply channels through-silicon connectors;and (d) dividing the wafer into individual printhead integrated circuits. Each printheadintegrated circuit thus formed is configured for backside-connection to the drive circuitryvia the through-silicon connectors the contact pads.
申请人：Gregory John McAvoy,Rónán Pádraig Seán O'Reilly,David McLeodJohnstone,Kia Silverbrook
地址：Balmain AU,Balmain AU,Balmain AU,Balmain AU
国籍：AU,AU,AU,AU
更多信息请下载全文后查看
