PQ070XZ01资料

SHAR ELECTRONIC COMPONE GROUP SHARP CORPORATION APPROVED BY: DATE: SPECIFICATION I I .DEVICE SPECIFICATION FOR Applied model name PQ070XZO 1 122 I 1 I I 1 VOLTAGE No. REGULATOR MODEL PQ070xz012 1 PQO7OXZO IZP 1. These specification sheets include materials protected under copyright of Sharp Corporation Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. (‘Sharp”). 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specihcation sheets. as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximrim ratings and the instructions included in these specification sheets. and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas ; OA equipment * Audio visuaI equipment Home appliances * Telecommunication equipment (Terminal) * Measuring equipment - Computers [ * Tooling machines If the use of the product in the above application areas is for equipment listed in paragraphs (21 or (3). please be sure to observe the precaulions given in those respective paragraphs. 1 1 /( (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for eqUi~Jmcr1~ which demands high reliability and safety in function and precision. such as : * Transportation control and safety equipment (aircraft. train. automobile etc.) * TrafIIc signals * Gas leakage sensor breakers * Rescue and security equipment [ - Other safety equipment (31 Please do not use this product for equipment which require extremely-high reliability ,L. and safety in function and precision. such as : i s Space equipment * Telecommunication equipment (for trunk lines) * Medical equipment [ - Nuclear power control equipment (4) Please contact and consuit with a Sharp sales representative regarding interpretation of the above three paragraphs. I. Please contact and consult with a Sharp sales representative 1 1 if there are any questions for any questions about this product DATE PRESENTED BY CUSTOMER’S APPKOVAL &I DATE BY K. Hachimura. Department General Managcr Enginrerin~ Dept..11 Opto-Electronic Devices Div. ELECDM Grottp SHARP CORPORATION of 元器件交易网www.cecb2b.comSHflRP CORPORATION 1. Application This specification applies to the outline and characteristics Model No. PQ070XZO 12. Usage PQO7OXZOlZ is the device for stabilization of positive output voltage with built-in ON/OFF function, the over current protectfon function, the overheat protection function, adjustable DC output voltage by using external resistance and low consumption current at OFF-state (stand-by). These devices are possible to use in power supply circuit up to current capacity l.OA. Block diagram Vin of series regulator (linear type), Vadj CND 2. Outline 3. Ratings : Refer to the attached and characteristics maximum sheet, Page 3. : Refer to the attached sheet, page 4 to 8. ratings 3.1 Absolute 3.2 Electrical 3.3 Electrical characteristics characteristf cs measuring circuit . (. 3.4 Pd-Ta rating (Typical value) 4. Reliability 5. Outgoing : Refer to the attached inspection sheet, Page 9. 10. i \\ : Refer to the attached sheet, Page 10. 元器件交易网www.cecb2b.comSHRHP CORPORflTION 6. Supplement 6.1 Example 6.2 Output : Refer to the attached of application voltage adjustment sheet, Page 11 to 17. characteristics (PQ070XZO IZPI 122) 6.3 Taping and reel packaging 6.4 Sleeve packaging 6.5 ODS materials (PQ070XZO This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials 6.6 Brominated for ODS : CFC,, Halon, Carbon tetrachloride, 1.1-l -Trichloroethane (Methylchloroform) flame retardants process Specific brominated flame retardants in this device at all. such as the PBBOs and PBB, are not used and ionized-particle radiation resistant. 6.7 This product is not designed as electromagnetic 7. Notes : Refer to the attached 7.1 External 7.2 Thermal connection protection design sheet, Page 18 to 2 1. 7.3 Static electricity 7.4 Soldering 7.5 For cleaning ;‘. i 1 元器件交易网www.cecb2b.com

SHMP CORPORFITION 2. Outline h ii DC inptt (Vin) ,?. ON/OFF control WC) j-1 DC output (Vo) 4 output voltage adjust.ment (Vadj) 5. GND Applied model No. (,9,,&01z2 I r 1 ZP I Marked model No. 070xz01 I 1 - [ 1 : TYP. - Unit : mm *Scale: 5/1 - Lead finish : Solder plating - Lead material : CII’ * Product mass : 0.3g I Pyo7oxzo o7oxzo 1 I 元器件交易网www.cecb2b.comSHflRP CtlRPORflTION 3. Ratings and characteristics 3.1 Absolute maximum ratings Ta=25% Parameter Input voltage ON/OFF Output voitage Symbol P 11 P 1) Vin vc Vadj t*u Rating IO 10 5 1 8 150 -40 to +85 -40 to +150 260 terminals. I Unit V V V A W % Conditions control voltage adjustment current (*a pin Output IO Power dissipation Junction Operating temperature temperature Pd -Cl Topr Tstg Tsol Refer to Fig. 1 (*3) ‘C % % For 10 s Storage temperature Soldering temperature (* 1) All are open except GND and applicable (*2) Pd : With infinite heat sink (‘31 There is case that over heat protection operates at the condition Tj=125C to 15o’C I (, i \\ 元器件交易网www.cecb2b.comSHARP CORPORATION Fig. 1 Pd - Ta rating Power dissipation Pd WI Ambient Pd : With infinite heat sink temperature Ta (C) (Note) There is case that over heat protection function operates at oblique line portion. ;‘. i 元器件交易网www.cecb2b.comSHflRP CORPORflTI ON 3.2 Electrical characteristics Unless otherwise specified condition shall be Vin=SV. Vo=3V (Rl=lkQ). Io=O.SA. Vc=2.7V Ta=25% Parameter Symbol Vin vo RegL RegI RR Vi-o Vref TcVref Vc (on) lc (on) vc (on) Ic (OffI MIN. 2.35 1.5 - - 45 - 1.225 - 2.0 - - - TYP. - - 0.2 0.2 60 - 1.25 fl.O - - - - 1 - - MAX. 10 7 2.6 1.0 - 0.5 1.275 - - 200 0.8 2 2 5 Unit V V % % dB v V % V pA V Io=OA Io=OA, Vc=O. 4V t to:OA vc=o.4v Tj=O to 125% io=5mA t*41 Io=FimA to l.OA Vin=4 to 8V 10=5mA Refer to Fig.3 Vin=2.85V, lo=O.tiA Conditions Input voltage Output voltage Load regulation Line regulation Ripple rejection Dropout voItage Reference voltage Temperature coefficient of reference voltage On-state control On-state control voltage for current for Off-state voltage for control Off-state current for control Quiescent current 1/ PA t. mA PA 19 Iqs Output off-state consumption current (*4) In case of opening control terminal (2th pin), output voltage turns OFF. 元器件交易网www.cecb2b.comSHflRP CORPORATION 3.3 Electrical characteristics measuring circuit portion Fig. 2 Standard measuring circuit of Regulator Vo=VrefX( l+R2/RI) ~1.25X(1+IU/RlI (Rl=lkQ, Vref+1.25Vl Vin r I 1 vo I----+ - / 1 $ R2 r T T n 0, 833 I: V Fig. 3 Standard measuring circuit of critical rate of ripple rejection f= 120Hz sine wave ei(rms)=0.5V Vin=5V Vo=3V (Rl=IkR) Io=O.3A RR=20 1 og (ei(rms)/eo(rms)) 1 Q 3 T T r 元器件交易网www.cecb2b.comSHARP CORPORATION 3.4 Pd - Ta rating (Typical value) Power dissipation Pd W’l Ambient temperature PCB Ta (‘Cl I (b i I Mounting PC6 - Copper foil Material : Class-cloth epoxy resin Size : 50 X 50 X 1.6mm Thickness of copper : 35 pm 元器件交易网www.cecb2b.comSHARP CORPORATION The reliability of products shall satisfy items listed below. Contfdence level : 90% LTPD : 10%/200/6 _ Test items Temperature cycling Humidity (Steady State1 Test Conditions 1 cycle -40C to + 150% (30min) (30min) 20 cycles test +60% .9O%RH. lOOOh Failure Judgement Crl teria VrefUX1.2 RegL>UX RegI>UX RR< LX0.8 Vi-o > UX 1.2 1.2 n=22. c=o 1.2 n=22. C=O n=22. C=O n=22. C=O n=22. C=O Damp Heat cyclic 1 cycle : -20% to 70% (2hl @h) Transfer time between high and low temp. is 1 h. 40 cycles test. 9O%RH +150%. lOOOh High temp. storage Low temp. storage Operation Mechanical Vibration (Variable frequency] Electrostatic discharge Soldering heat life shock -40-C, 1 OOOh Ta=25”C. Pd=0.8W, lOOOh n=22. c=o n=ll. C=O 15000m/s2, 0.5ms 3 times/ +X. +Y. +Z 200m/s2, 100 to 2000 to lOOHz/4 min 4 times/ X. Y, 2 direction +25OV, 200pF. OQ Between GND and each terminal/ 3 times 260°C. 10 s, Dip up to 0.5mm from resin portion Weight: I ON 10 s/ each terminal Weight: 2.5N -0’ On -go’ each terminal ‘2 Failure if it has breakdown and loosened pin. l 4 Failure if solder shall not be adhere at the area of 95% or more dipped portion. l 5 ‘1 U: Upper specification limit L: Lower specif,Qation limit i 1 I n=ll. C=O n=l1. n=ll. n=ll. C=O C=O C=O Robustness of Termination (Tensile test) Robustness Termination (Bending of test) -go’ ‘3 -0’ n=i 1. C=O Solderability 23Ok5’C. 520.5 s Use rogin Rux l l n=ll, C=O 元器件交易网www.cecb2b.comSHARP CORPORATION * 1 SoIdering area is shown below. OSmm Weight *3 Terminal bending direction is shown below. *4 Except for the bending of terminal. *5 Except for the portion within 0.5mm from the interface between the heat sink and the resin portion, and the side surface of heat sink. J, Weight 5. Outgoing inspection . TABLE II-A single sampling plans for normal inspection based on&O 285$ is applied. The AQL according to the inspection items are shown below. Defect Inspection items AQL (o/o) Judgemen t criteria Major Electrical characteristics defect 0.1 Unreadable marking Depend on the specihcation Minor Appearance defect 0.4 Dimensions 元器件交易网www.cecb2b.comSHflRP CORPORATION 6. Supplement 6. I Example of application DC input T - R2 T VO Yin/ j-CM I -I- I ON-OFF signal + zczco Rl 1kQ - Load High : Output ON or Open : Output OFF I . (. i 元器件交易网www.cecb2b.comSHARP CORPORATION 6.2 Output voltage adjustment characteristics Rl=?kS2 I 6 I 1 I I I I I I I / I i I output v&age I t I I I 元器件交易网www.cecb2b.comSHARP CORPORATION 6.3 Packing 6.3.1 specifications (PQ070XZO UPI Packing conditions and Dimensions (Refer to Fig. A) (1) Tape structure The tape shall have a structure in which a cover tape is sealed heat- _ pressed on the carrier tape of polystyrene emboss protect against static electricity. Dimensions are shown Fig. A. (2) Reel structure and Dimensions (Refer to Fig-B) Dimensions are shown Fig. B. The reel shall be made of polystyrene. (3) Direction of product insertion (Refer to Fig. C) at Product direction in carrier tape shall direct to the radiate fin of product the hole side on the tape. 6.3.2 Tape characteristics ( 1) Adhesiveness of cover tape The peel-back force between carrier tape and cover tape shall be 0. IN to O.8N for the angle from 160’ to 180. . (Tape speed : 5mm/s) (2) Bending strength Sealed tape : Bended tape radius shall be more than 30mm. If bended tape radius is less than 30mm. there is case that cover tape come otf carrier tape. (3) Carrier tape : Bended tape radius shall be more than 15mm. 6.3.3 Rolling method and quantity (. i \\ (1) Rolling method Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20 pitch of empty cavities to the trailer and attach more than 10 pitch of empty cavities to the leader of the tape and fix the both ends with adhesive tape. (2) Quantity One reel shall contain 3000 PCS. 元器件交易网www.cecb2b.comSHflRP CORPORATION 6.3.4 Indication (1 ) Reel The reel shall be pasted labei with following information. * Model No. (2) Package case The outer packaglng l l Number of pieces contained * Production date case shall be marked with following information. of pieces contained * Inspection date Model No. l Number 6.3.5 Storage condition Taped products shall be stored at the temperature lower than 5 to 30-C and the humidities lower than 7O%RH. If taped products aren’t used longer than for -10 days, Please rewind the tape pulled out and storage. 6.3.6 Others (1) joint of tape The cover tape and carrier tape in one reel shal1 be jointless. (21 The way to repair taped failure devices The way to repair taped failure devices cut a bottom of carrier tape with a cutter. and after replacing to good devices, the cutting portion shall be sealed with adhesive tape. Fig. A Tape structure and Dimensions - Dinwnsions : ‘p/P. ValIW Unit : mm 元器件交易网www.cecb2b.comSHRRP CORPURRTION March 7. 2000 Fig. B Reei structure and Dimensions Dimensions : TYP. value Unit : mm Fig. C Direction of product insertion 元器件交易网www.cecb2b.com

SHARP CORPORATION 6.4 Sleeve pat kaglng (PQ070XZO 6.4.1 Packing conditions I ZZ) ( 1) Sleeve structure . and Dimensions (Refer to Fig. D) The sleeve shall be made of high inpuct polethyiene (Plastics wtth preventing static electricity). Dimensions are shown Fig. D. cardboard. (2) The packing case shall be made of corrugated Dimensions are shown Fig. F. (3) Stopper structure The stopper shall be made of styrene butadlene rubber. 6.4.2 Packaging method method and quantity (1) Packagfng Max. 75pcs. of products shall be packaged in a sleeve and both of sleeve edges shall be fuFig. D 2Sleeve \\ $Stopper (With pulled portion) 4 0 sleeves Fig. E ( 1 0 IinesX Fig. F \\ / \\ &i&2 / (568) ’ Inspection L date I 元器件交易网www.cecb2b.com

SHflRP CORPORRTlON 7. Notes 7.1 External connection C-MOS or TTL (11 Please perform shortest wiring for connection between Cin, Co and the individual terminal or fin. There is case that oscillation occurs easily by kinds of capacitor and capacity. Before you use this device, you should confirm output voltage on your use mounting state. (2) The input terminal for ON/OFF output control : ‘2’ is compatible with LS-TTL. and direct driving by TTL or C-MOS standard logic (RCA 4000 series) is also available. In case that ON/OFF terminal is not used. we recommend to connect the ON/OFF terminal directly to the input terminal : i input voltage. (3) As voltage application under conditions that the device pin is inserted divergently or reversely, may occur the degradation of characteristics or breakdown of the device, please avoid it absolutely. 7.2 Thermal Internal protection design (Pd) of device is obtained 1 power dissipation i by the following eflriation. (. Pd=IoX(Vin-Vo)+VinXlq If the ambient temperature and Pd at the device operating state. make the thermal design enough to radiate the heat as allows the device to operate within the safety operation area specified by the derating curve in para. 3.4. Insufficient radiation gives an unfavorable intluence to the normal operation and reliability of the device. In the case of no passage within the safety operational territory illustrated by the derating curve. the overheat protection circuit operates to let output fall down, please avoid keeping such condition for a long time. 元器件交易网www.cecb2b.com

Good caution must be exercised against static electricity since this device consists of a bipolar IC. Following-are some examples of preventive measures against excessive voltages such as caused by static electricity. (a) Human body must be grounded or cloth. to discharge the static electricity from the body (b) Anything that is in contact with the device such as workbench, inserter. or measuring instrument must be grounded. (c) Use a solder dip basin with a minimum leak current (isolation resistance 10MQ or more) from the commercial Also the solder dip basin must be grounded. 7.4 Soldering (I) Reflow soIdering It is recommended that within two times soldering be done at the temperature and the time within the temperature profile as shown in the figure. (The temperature shown in the figure is fin portion temperature of the device.) It is recommended that the second reflow become at the device which is the room temperature. (a) An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. The temperature of resin portion should be with in the temperature profile below. (b) The temperature 240°C sloping when soldering-reflow is 4C /s or less. power supply. 180°C 25% 元器件交易网www.cecb2b.com3nnnr Lunrunnl fu(* (21 Dip soldering We recommend that solder dip should be 260% (Bolder temp.) Please obey the note items below concerning solder reflow. (a) After solder dip. please do cooling naturally. (bl Please shaIl not give the mechanical (3) Hand soldering This device is basically designed for the soldering such as reflow soldering or dip soldering. In case when hand soldering is reluctantly needed for modification etc., it is recommended that only one hand soldering should be done at 260°C or less of soldering iron edge. temperature. for 10s or less. Please be careful not to touch soldering iron edge to leads directly etc. in order not to give any stress to the leads. Even within the above conditions regarding solder reflow, solder dip or hand soldering there is the possibility that the stress given to the terminals by the deformation of P(X3 makes the wire in the device package cut. In advance, please confirm fully at the actual application. 7.5 For cleaning (1) Solvent cleaning (2) Ultrasonic : Solvent temperature 45% or less immersion for 3 min or less : The effect to device by ultrasonic cleaning differs by cleaning bath size. ultrasonic power output, cleaning time. PCB size or device mounting condition etc. Please test it in actual using condition and confhm that doesn’t occur any defect before starting the ultrasonic cleaning. alcohol stress or the impact stress to the device. 10s or less and 1 time only. cleaning (3) Applicable solvent : Ethyl alcohol. Methyl alcohol, Isopropyl In case when the other solvent is used. there are cases that the packaging resin is eroded. Please use the other solven,t i after thorough confirmation is performed in actual using condition. ’ 元器件交易网www.cecb2b.comSHRRP CORPORfnIUN 7.6 Output voltage fine tuning Connecting external resistors R1 and R2 to terminals 3 , 4 . 5 ailows the output voltage to be fine tuned from 1.5V to 7. Refer to the tlgure below and “Paragraph 6.3 Output voltage adjustment characteristics” when connecting external resistors t’or Ane tuning output voltage. +R2/RI) +1.25x( 1+R2/ 1000) (RI=lkR. Vref+1.25VI II (. i \\