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专利名称：Multichip module and method of forming
same
发明人：Leonard W. Schaper申请号：US083947申请日：19950228公开号：US06297460B1公开日：20011002
专利附图：
摘要：An electrical interconnection medium is provided having first and secondoverlying interconnection layers. Each interconnection layer includes parallel conductors,and the conductors of the first and second interconnection layers are oriented
orthogonally to each other. The conductors can be interconnected to form at least twoelectrical planes, with the conductors of the electrical planes being substantiallyinterdigitated on each interconnection layer, portions of each plane appearing on bothlayers. The interconnection medium advantageously is employed as a multichip module.A method of designing such an MCM includes providing arranged conductive regions in aspaced manner, cutting selected sections to form signal conductor paths, and then fillingspaces between like power and ground conductors. Another embodiment providesarranging touching conductive regions, defining signal path areas along uniformly-spacedtouching borders, and then carving away conductive material to form desirablypositioned and spaced power, ground and signal conductors.
申请人：THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS
代理机构：Miles & Stockbridge, P.C.
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