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专利名称：Mounting system
发明人：Mutsumi Masumoto,Katsumi Terada申请号：US11887212申请日：20060313公开号：US07621969B2公开日：20091124
专利附图：
摘要：A mounting system is provided with a substrate loader section, a chip mountingsection, and a substrate unloader section for sequentially taking out substrateswhereupon chips are mounted. The mounting system is characterized in that thesubstrate loader section is provided with an oven capable of heat insulating a substrate
together with a substrate magazine capable of containing a plurality of substrates, astage heater for heating/heat insulating a substrate is provided, respectively, at a
substrate conveying portion from a substrate waiting stage for the chip mounting sectionto the chip mounting section, at the chip mounting section, and at a substrate conveyingportion from the chip mounting section to the substrate unloader section, and thesubstrate unloader section is provided with an oven capable of heat insulating asubstrate together with a substrate magazine capable of containing a plurality ofsubstrates whereupon chips are mounted. The substrate can be sustained at a desirabletemperature over the substantially entire mounting process having a series of steps, andin particular, occurrence of problems ascribed to moisture absorption can be suppressedor prevented.
申请人：Mutsumi Masumoto,Katsumi Terada
地址：Oita JP,Shiga JP
国籍：JP,JP
代理机构：Smith Patent Office
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