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专利名称：Flat interconnection semiconductor package发明人：Jiahn-Chang Wu申请号：US09480353申请日：20000110公开号：US06291841B1公开日：20010918
专利附图：
摘要：Flat metal strips are used to make connections to a laser diode so that theinterconnections are parallel to the surface of the semiconductor device and the
structure has a lower profile than a wire-bonded package. The contacts can be made withconducting glue or hard pressed by a lid before sealing with glue.
申请人：WU JIAHN-CHANG
代理人：H. C. Lin, Patent Agent
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