DOW Liquid Epoxy Resins

DOWLIQUIDEPOXYRESINSNote: Safety information on the handlingof novolac resins, epoxy resins, solvents,diluents, modifiers, and other common“epoxy” formulation materials is critical.However, plant conditions and environ-ments vary so widely, no warranty of anykind can be given. Formulators-customersshould contact their suppliers of each ofthese materials for specific safe handlingrecommendations. Companion bulletins,DOW Epoxy Resins Product Stewardship,Safe Handling and Storage Manual(Form No. 296-00312) and DOW EpoxyCuring Agents Product Stewardship, Safe Handling and Storage Manual (Form No. 296-01331), are available from theDow Plastics (Thermoset Applications)Department or your Dow sales representative.©1966, 1969, 1976, 1988, 1990, 1998, 1999The Dow Chemical CompanyAll rights reserved.Liquid Epoxy Resins Cured with BF3· MEAPhysical Properties . . . . . . . . . . .27Electrical Properties . . . . . . . . . .28Chemical, Solvent Resistance, and Thermal Degradation . . . . . . .29Liquid Epoxy Resins Cured with Polyamide Curing AgentPhysical Properties . . . . . . . . . . .30Electrical Properties . . . . . . . . . .31Chemical, Solvent Resistance, and Thermal Degradation . . . . . . .32Liquid Epoxy Resins Containing a Reactive DiluentPhysical Properties . . . . . . . . . . .32Electrical Properties . . . . . . . . . .33Chemical, Solvent Resistance, and Thermal Degradation . . . . . . .33ContentsIntroduction . . . . . . . . . . . . . . . . . .2Products and Properties . . . . . . . . . . .3Resin Structure . . . . . . . . . . . . . . . . . .5Resin Performance Data . . . . . .16Test Methods . . . . . . . . . . . . . . . . . . . .17Chemical and Solvent Resistance . . . . . . . . . . . . . . . . . . . . . .17Cure Schedules . . . . . . . . . . . . . . . . . .18Liquid Epoxy Resins Cured with D.E.H.* 24Physical Properties . . . . . . . . . . .19Electrical Properties . . . . . . . . . .20Chemical, Solvent Resistance, andThermal Degradation . . . . . .21Liquid Epoxy Resins Cured with 1,2-Cyclohexane DiaminePhysical Properties . . . . . . . . . . .22Electrical Properties . . . . . . . . . .22Chemical, Solvent Resistance, and Thermal Degradation . . . . . . .23Liquid Epoxy Resins Cured with NadicMethyl AnhydridePhysical Properties . . . . . . . . . . .24Electrical Properties . . . . . . . . . .25Chemical, Solvent Resistance, and Thermal Degradation . . . . . . .26Curing Agents . . . . . . . . . . . . . . . .6Primary and Secondary Polyfunctional Amines . . . . . . . .6Aliphatic Polyamines . . . . . . . . .7Aromatic Polyamines . . . . . . . . .7Calculation of Stoichiometric Ratios . . . . . . .7Anhydrides . . . . . . . . . . . . . . . . . . . . .9Polyamides . . . . . . . . . . . . . . . . . . . . .10Catalytic Curing Agents . . . . . . . . . . .11Additional Property Data . . . . . .34Storage . . . . . . . . . . . . . . . . . . . . . . . .35Hazards And Handling Precautions . . . . . . . . . . . . . . . . . . . .36Health Hazards . . . . . . . . . . . . . . . . . .36Handling Precautions . . . . . . . . . . . . .38Flammability . . . . . . . . . . . . . . . . . . .39Spill Containment and Cleanup . . . . .39Reactive Diluents, Modifiers, Fillers . . . . . . . . . . . . . .12Reactive Diluents . . . . . . . . . . . . . . . .12Resin Modifiers . . . . . . . . . . . . . . . . . .13Fillers . . . . . . . . . . . . . . . . . . . . . . . . .14Appendix–Abbreviations . . . . . . .40Product Stewardship . . . . . . . . . .41Epoxy Formulating Techniques . . . . . . . . . . . . . . . . . . .15Equipment . . . . . . . . . . . . . . . . . . . . .15Temperature Control . . . . . . . . . . . . .15Viscosity vs Temperature of D.E.R.Liquid Epoxy Resins . . . . . . . . . .151INTRODUCTIOND.E.R.* liquid epoxy resins, developedand marketed by The Dow ChemicalCompany, are commercially establishedas major raw materials in the fields oftooling, encapsulation, adhesives, lami-nates, and coatings.Similar commercial success has beenearned by the families of D.E.R. solidand solution epoxy resins, flexibleepoxy resins, brominated epoxy resins,D.E.N.* epoxy novolac resins, andD.E.H.* epoxy curing agents … alsoproduced and marketed by Dow. And since these products are used withvarious curing agents, diluents, andmodifiers, an almost unlimited range andvariety of properties may be obtained.This bulletin describes the bisphenol A-based liquid epoxy resins and aliphaticglycol epoxy resins offered by Dow.Information on other DOW epoxy andepoxy-related products may beobtained from your Dow sales repre-sentative or by calling 1-800-441-4369.The curing of a liquid epoxy resin —i.e., converting it to a thermoset solid— is fundamental to its commercialuse. This is also true of epoxy, poly-ester, phenolic, and melamine resins.However, liquid epoxy resins, becauseof their structure and the method oftheir cure, are superior to these otherresins in the following properties:• No volatile lossduring cure of product.•Dimensional stability duringcure.They exhibit little shrinkageand can be used for very accurate reproduction.•Chemical resistance. Good resistance to a variety of chemicals(including solvents, acids, and bases)results with properly cured formulations.•Chemical inertness. They accept awide range of fillers and pigments;they do not affect encapsulated partsor common containers.•Durability. Cured formulationsexhibit good hardness, impactstrength, and toughness.•Adhesion. The tenacity of epoxyadhesion to almost any surface is without equal among organic coatings.•Versatility in curing agent choiceand curing conditions.Typically, bisphenol A/epichlorohydrinbased resins, novolac based epoxyresins, and other di- or multifunctionalresins containing the aromatic ringstructure will cure to hard, rigid com-positions having rather low impact andelongation characteristics. There aremany approaches to improving theseproperties and increasing flexibility inepoxy resin systems. Among them aremodifications with vegetable oils,polyamide or polysulfide curing agents,or long chain polyglycols. However,such modifiers often adversely affectthe physical, chemical, or solvent resis-tance properties of an epoxy system, orthey limit the choice of curing agentsand thus limit use in many applications.D.E.R. 732 and D.E.R. 736 flexibleepoxy resins are designed to overcomemany of the specific disadvantages ofthese other flexibilizing systems. Theyare compatible with practically all otherepoxy resins and are shelf stable aftermixing. Because they are true epoxyresins, they react with all epoxy curingagents and become an integral part ofthe cured system.Table 1 on page 4 lists the typical properties of DOW liquid epoxy resins;Table 2 lists the typical properties of two liquid epoxy resins that contain a reactive diluent (a C12-C14aliphatic glycidyl ether), which provides reducedviscosities. Each resin is brieflydescribed in the following paragraphs.Table 3 lists the typical properties oftwo flexible epoxy resins.Note: Prior to handling any of these resins,or related curing agents, diluents, catalysts,or solvents, be certain you have acquiredfrom your supplier(s) adequate information pertaining to safe operations for your workersand your plant. Request Material Safety Data(MSD) sheets for each product from its supplier. See “Hazards” section, pages 39-42,and the bulletins mentioned in the note onthe inside of the front cover.*Trademark of The Dow Chemical Company.2PRODUCTSANDPROPERTIESD.E.R. 317 Epoxy ResinA high viscosity, fast reacting (20% fasterthan D.E.R. 331) liquid epoxy resindesigned for adhesive applicationsrequiring quick gelling with amine cur-ing agents.D.E.R. 324 Epoxy ResinA formulated blend of D.E.R. 331 and aC12-C14aliphatic glycidyl ether to producea low viscosity product. The product hasutility in filled formulations for flooringcompounds, grouts, adhesives,decoupage coatings, and high solidscoatings. Blend ratio is 83/17 D.E.R. 331to diluent.D.E.R. 325 Epoxy ResinA medium viscosity resin blend of 92/8ratio of D.E.R. 331 to C12-C14aliphatic gly-cidyl ether. Used in same applications asD.E.R. 324.D.E.R. 330 Epoxy ResinA low epoxide equivalent weight liquidresin processed to give very low viscosi-ty without the use of a reactive diluent.D.E.R. 331 Epoxy ResinA general purpose, widely used liquidresin. It is recognized as a standard fromwhich variations have been developed.D.E.R. 332 Epoxy ResinThe uniqueness of D.E.R. 332 epoxyresin is reflected in its maximum epox-ide equivalent weight of 178 (chemicallypure diglycidyl ether of bisphenol Awould have an epoxide equivalent weightof 170). Because of its high purity andlack of polymer fractions, D.E.R. 332 resin provides uni-form performance and excep-tionally low viscosity andcolor. Under some conditions of cure, asillustrated in the cure schedule andproperty data (pages 18-33), it givesimproved elevated temperature proper-ties.D.E.R. 332 resin frequently crystallizesat room temperature. The pure digly-cidyl ether of bisphenol A is a solid witha melting point of approximately 42°C(108°F). Crystallization may be inducedby chilling, seeding by dust particles, orincorporation of filler. Warming to 50-55°C (122-131°F) restores the resin to aliquid state. Long-term warm storagemay result in slight discoloration butdoes not affect resin performance.D.E.R. 337 Epoxy ResinAn intermediate epoxide equivalentweight bisphenol A semi-solid epoxyresin. Used in adhesives and coatings oras a modifier for other epoxy resins toimprove impact strength, extensibility,and adhesion.D.E.R. 362 & D.E.R. 3 Epoxy ResinsMedium viscosity liquid epoxy resinsbased on bisphenol A which possessesthe unique characteristic of crystalliza-tion resistance.†D.E.R. 362 and D.E.R.3 contain no solvents, no diluents, andare suited for applications ranging fromcoatings to composites. D.E.R. 383 Epoxy ResinA liquid epoxy resin designed to providereduced viscosity and extended pot lifewhile maintaining properties essentiallyequivalent to those of D.E.R. 331 epoxyresin.D.E.R. 732 & D.E.R. 736 Epoxy ResinsD.E.R. 732 and D.E.R. 736 are polygly-col di-epoxides. Dow flexible epoxyresins are principally used as additivesto base epoxy systems in formulationswhere greater elongation, higherimpact resistance, and increased flexi-bility are required.†Note: Under certain conditions, liquid epoxyresins may crystallize. Crystallization may takethe form of turbidity or the presence of crystals inthe material or on the container. Occasionally,crystallization may continue to the point wheresolidification occurs. The occurrence of crystalliza-tion is in no way an indication that an epoxy resinis contaminated or out of specification. Rather, itis a phenomenon which can occasionally occurduring storage at room temperature or below.Material that shows evidence of crystallizationcan be returned to its original liquid state byheating it to a temperature of approximately50°C (122°F). This temperature should bemaintained until dissolution occurs. Suggestionsfor heating include the use of a standard ventedlaboratory convection oven or steam. If steam isused, it should be circulated around tightlyclosed containers which have been assembledunder a tarpaulin. (Note: Always exercise good safety habits when working with elevatedtemperatures. Also, for further informationand/or advice on dissolution procedures, call orwrite The Dow Chemical Company, Dow Plastics, Customer Information Group, P.O. Box 1206, Midland, MI 481-1206, (1-800-441-4369), FAX 517-832-1465.Crystallization is chiefly a result of the purityand uniformity of a liquid epoxy resin. For example, pure diglycidyl ether of bisphenol A(DGEBA) is a solid. Factors that may encouragecrystallization include thermal cycling and thepresence of filler, which acts as seed material forcrystal formation. To discourage crystallization,store epoxy resins at room temperature or higher.Also, avoid situations where temperatures cyclefrom room temperature to lower temperatures,as is sometimes the case in a warehouse.3Table 1Typical Properties†of DOW Liquid Epoxy ResinsViscosityRange(cps @ 25°C)16,000-25,0007,000-10,00011,000-14,0004,000-6,000400-800 14,500-6,5004,000-7,000 9,000-10,500FlashPoint,(°F) 2485485485485485480480485SpecificGravity,25/25°C1.161.161.161.161.161.141.161.16Weight(Lbs/Gal)@ 25°C9.79.79.79.79.79.59.79.7ResinD.E.R. 317D.E.R. 330D.E.R. 331D.E.R. 332D.E.R. 337D.E.R. 362D.E.R. 3D.E.R. 383EpoxideEquiv. Wt.192-203176-185182-192172-176230-250185-205190-210176-183Color, Max(Gardner)5125 3125 375 3312125 3170% non-volatile in DOWANOL* DB solvent.2Pensky-Martens, ASTM D-93.3APHA Color — ASTM method 1209.†Typical properties; not to be construed as specifications.Table2Typical Properties†of DOW Liquid Epoxy Resins Containing a Reactive DiluentEpoxideEquiv. Wt.197-206185-206ViscosityRange(cps @ 25°C)600-800850-2,800Color, Max(Gardner)32FlashPoint,(°F)1350375SpecificWeightGravity,(Lbs/Gal)25/25°C@ 25°C1.119.31.149.5ResinD.E.R. 324D.E.R. 3251Pensky-Martens, ASTM D-93.†Typical properties; not to be construed as specifications.Table 3Typical Properties†of DOW Liquid Epoxy Resins Based On Polyglycol Di-epoxides EpoxideEquiv. Wt.305-335175-205ViscosityRange(cps @ 25°C)55-10030-60Color, Max(APHA)125125FlashPoint,(°F)1310320SpecificWeightGravity,(Lbs/Gal)25/25°C@ 25°C1.068.91.149.5ResinD.E.R. 732D.E.R. 7361Pensky-Martens Closed Cup†Typical properties; not to be construed as specifications.4STRUCTURERESINEpoxy resins contain a reactive oxirane structure O—CH—CH2which is commonly referred to as an “epoxy” functionality. Liquid epoxyresins are converted through these reactive epoxy sites into tough, insoluble, and infusible solids.The simplest possible epoxy resin derived from the reaction of bisphenolA and epichlorohydrin is (2,2-bis[4-(2'3' epoxy propoxy) phenyl]propane), commonly called the diglycidyl ether of bisphenol A (DGEBA). O CH3 OCH2—CH—CH2—O— —C— —O—CH2—CH—CH2 CH3 The higher molecular weight homologs are represented by the following theoretical structure: O CH3 OHCH2—CH—CH2——O— —C— —O—CH2—CH—CH2—— CH3 CH3 O—O— —C— —O—CH2—CH—CH2 CH3 nGeneric Bisphenol A Based Epoxy Resin Chemical StructureWith increasing molecular weight, another reactive site — the OH group— is introduced. This group can react at higher temperatures with anhy-drides, organic acids, amino resins, and phenolic resins, or with epoxidegroups (when catalyzed) to give additional cross-linking.Typical value of “n” is about 0.15 for D.E.R. 331 epoxy resin (epoxy equiv-alent weight range of 182-192 and viscosity of 11,000-14,000 cps at 25°C).The low melting point solid resins begin at an “n” of about 2.5. In high melting point solid resins, “n” may be as high as 18. O R R´ OCH2—CH—CH2—O——CH2—CH—O——CH2—CH—O—CH2—CH—CH2 nGeneric Aliphatic Polyglycol Diepoxide StructureD.E.R. 736 resin has a lower value of “n,” and hence a shorter chainlength than D.E.R. 732.5AGENTSCURINGThe amines react with the epoxygroup through the active aminehydrogen. Each primary aminegroup is theoretically capable of reactingwith two epoxide groups, and each sec-ondary amine group is capable of react-ing with one epoxide group. The reac-tion of a primary amine with an epoxy isseen as follows: O RNH2 +CH2—CH HRN—CH2—CH OHMany commercial materials are suitableas reactive cross-linking agents for liq-uid epoxy resins. The most commontypes of curing agents are:• primary and secondary polyamines and their adducts• anhydrides• polyamides• catalytic typesThe presence of hydroxyls, however,has an important function becausethey assist in opening the epoxidering. Alcoholic or phenolic hydroxylsaccelerate the primary and secondaryamine cures and thus provide for themore rapid gel time of the amineadducts and the higher molecularweight resins. Primary And SecondaryPolyfunctional AminesTypical of this class of curing agents arealiphatic amine compounds, such asD.E.H. 20 epoxy hardener (diethylenetriamine), D.E.H. 24 epoxy hardener (triethylene tetramine), and D.E.H. 26epoxy hardener (tetraethylene penta-mine). Also used are adducts of theabove amines with epoxy resins, dilu-ents, or other amine-reactive com-pounds. Room temperature cures areusually employed.Aromatic amines, such as metaphenylenediamine and diamino diphenyl sulfone,are also widely used to achieve higherheat distortion temperatures. Elevatedtemperature cures are usually employed.The secondary amine thus formedreacts further:H O RN—CH2—CH + CH2—CH OH OHRNCH2—CHCH2—CH OHTheoretically, the hydroxyls formedshould be capable of reacting with epoxygroups to form an ether linage: OCH + CH2—CHOHCHOCH2—CH OHThis reaction is often catalyzed by tertiary amines. However, the tertiaryamine formed by the epoxy-secondaryamine reaction is apparently too immo-bile and sterically hindered to act as acatalyst.6Aliphatic PolyaminesThe liquid aliphatic polyamines and theiradducts are convenient to handle, giveexcellent cured resin physical character-istics, including chemical and solventresistance, and cure at ambient or mod-erately elevated temperatures. Goodlong-term retention of properties is pos-sible at temperatures up to 100°C.Short-term exposure at higher tempera-tures can be tolerated. Pot life is shortand exotherm is high in thick sectionsand large masses. See Table 4.Aromatic PolyaminesMost aromatic polyamines are solidsand are usually incorporated in the resinby melting at elevated temperatures. Pot life is considerably longer than withaliphatic polyamines, and elevated tem-perature cures are required to developoptimum properties. See Table 5.Cured systems give excellent perfor-mance up to about 150°C (302°F). Theyare used in adhesives, wet lay-up lami-nates, tooling, small pottings, and coat-ings. Shrinkage of aromatic polyaminecured resins, particularly with the high-molecular-weight resins, is quite low —a useful feature for encapsulation andpotting. Calculation of Stoichiometric RatiosTo obtain optimum properties with poly-functional epoxide-reactive curing agents (particularly the amines), it isdesirable to react the resin and the cur-ing agent at approximately stoichiometricquantities. To determine the ratiorequired, calculations can be made asfollows, using D.E.H. 20 (NH2— CH2—CH2— NH — CH2— CH2— NH2) as an example:1. To calculate the Amine H equivalentweight, use the following equation:Equation (3):EEW of mix = Total WtWt aWt bWt c++EEWaEEWbEEWcTotal weight includes all materials,both reactive and nonreactive.a,b,c, etc., are only the materials reactive with the curing agent, and are characterized by an epoxy ring.Equation (1):Amine H eq wt = MW of amineno. of active hydrogenExample:103.2Amine H eq wt D.E.H. 20 = = 20.65Example:100 parts D.E.R. 331100 parts D.E.R. 33730 parts BGE (diluent)230 parts Filler460 Total460460EEW of mix = = = 3911.1766100+ +100301240130Avg EEW 1Avg EEW 240Avg EEW 130 —2. To calculate the stoichiometric ratio ofDEH 20 to use with D.E.R. 331 epoxyresin having an epoxide equivalentweight of 1:Equation (2):phr† of amine = Amine H eq wt ϫ 100Epoxide eq wt of resinBy equation (2):20.6 ϫ 100Amount D.E.H. 20 = = 5.27 parts per391hundred parts filled formulation†Parts by wt per 100 parts resinExample:phr D.E.H. 20 to be used with D.E.R. 331.20.6 ϫ 100phr = = 10.913.Frequently, epoxy resins are blended,filled, or modified with reactive andnonreactive components. It is thennecessary to adjust the concentrationof the curing agent to cure only theportion of the mix that is reactive;e.g., the resins and any reactive dilu-ent present. This may be simply doneby calculating the epoxide equivalentweight (EEW) of the total mix andthen applying equation (2) to deter-mine the amount of curing agent toadd to 100 parts of formulation.7Table4Aliphatic Polyamines and Adducts†Wt. PerActiveH20.6PHRD.E.R.33110.9Suggested CureScheduleGel at RT plus several days at RTor 1-2 hrs at 100°C for full cure.Curing AgentD.E.H. 20 (diethylene triamine, DETA)D.E.H. 24 (triethylenetetramine, TETA)D.E.H. 26 (tetraethylene pentamine, TEPA)D.E.H. 29 (amine mix)SourceThe Dow Chemical CompanyDowCommentsGeneral purpose RT curing agent. High exotherm inlarge mass. May blush under humid conditions.24.412.9Gel at RT plus several days at RTor 1-2 hrs at 100°C for full cure.General purpose RT curing agent. High exotherm inlarge mass. Lower vapor pressure than D.E.H. 20.May blush under humid conditions.RT curing agent often used in 2 package protective coating systems. May blush under humid conditions.27.114.3Gel at RT plus several days at RTor 1-2 hrs at 100°C for full cure.Dow28.815.2Gel at RT plus several days at RTor 1-2 hrs at 100°C for full cure.DowAmine curing agent with low vapor pressure for saferhandling. Similar in properties to D.E.H. 24 but curedsamples have less tendency to blush when cured underhumid conditions.Trifunctional amine with short pot life. Imparts moderatedegree of flexibility and gives improved impact.D.E.H. 39 (amino ethyl piperazine, AEP)D.E.H. 52 (amine-epoxy resinadduct)D.E.H. 58 (accelerated aliphatic amine)XUS 19036.00 (polyethylenepolyamine)4322.8Gel at RT plus several days at RTor 1-2 hrs at 100°C for full cure.Dow5328.0Gel at RT plus several days at RTor 1-2 hrs at 100°C for full cure.DowAmine adduct with D.E.R. 331. Fast cure time. Viscosity6,000-8,000 cps. Lower vapor pressure and less criticalratios offer improved handling characteristics.Amine containing an accelerator for fast reacting ambient cure systems.3015.9Gel at RT plus several days at RTor 1-2 hrs at 100°C for full cure.Dow3418.0Gel at RTplus several days at RTor 1-2 hrs at 100°C for full cure.DowAmine curing agent with low-odor, non-corrosive andexcellent chemical-resistant properties, especially for secondary containment applications with reduced blushtendency under humid cure conditions.RT = Room Temperature†Typical properties; not to be construed as specifications.8Table5Aromatic Polyamines†Wt. PerActiveH27PHRD.E.R.33114.3Suggested CureScheduleGel at 55°C + 2 hrs at 125°C + 2hrs at 175°C.Curing AgentMetaphenylenediamine (MPDA)CommentsAromatic diamine with a melting point of approx. 60°C.Can be used to make eutectic mix. Good elevated temp.performance. Used in laminates, castings, and filament winding.Aromatic polyamine with a melting point of approx.175°C. Used in laminates. Has good B-stage shelf life.Cure may be accelerated with BF3•MEA or aliphatic amines.Low viscosity liquid aromatic diamine. Gives longer potlife than other aromatic amines. Low exotherm.Diamino diphenylsulfone (DDS orDADS)5730.21 hr at 150°C 3 hrs at 220°C.Diethyltoluenediamine44.623.62 hrs at 100°C 4 hrs at 175°C.†Typical formulations and cure schedules only; not to be construed as specifications.AnhydridesLiquid and solid anhydrides are extensively used to cure epoxy resins.Products typical of this class are shownin Table 6.The reactivity rate of some anhydrideswith epoxies is slow. An accelerator, usual-ly a tertiary amine, is often used (0.5% to3%) to speed gel time and cure. The opti-mum amount is usually critical, dependingupon the anhydride and resin used andcure schedules. Amounts above or belowthe “correct” amount reduce high temper-ature performance. The “best” concentra-tion should be determined experimentally.Eutectic mixtures to depress resin melt-ing points may be prepared.The reaction of anhydrides with epoxygroups is complex, with several compet-ing reactions capable of taking place. The three most important are:1.The opening of the anhydride ringwith an alcoholic hydroxyl to form the monoester: O O—C—C —C—C—O—CH O + HO—CH—C—C —C—C—OH O O2.Subsequent to (1), the nascent car-boxylic groups react with the epoxideto give an ester linkage: O—C—C—O—CH—C—C—OH O O+ CH2—CH O—C—C—O—CH—C—C—O—CH2—CH O OHAt low elevated temperature cures, theether and ester reactions take place atabout the same rate. At higher tempera-tures, the ester linkage occurs more frequently, and this probably accounts forthe reduced elevated temperature perfor-mance of systems gelled at initially hightemperatures. Since reaction (3) can takeplace independently in the acid medium,the ratio of anhydride to epoxy is less critical than with an amine. It can varyfrom 0.5 to 0.9 equivalents of anhydrideper equivalent of epoxy and should bedetermined experimentally to achievedesired properties. Pot life of the mix is usually long;exotherm is low. Elevated temperaturecures are necessary and long post curesare required to develop ultimate proper-ties. Electrical and physical strength properties are good over a wide tempera-ture range. Chemical resistance to somereagents is less than with amine-cured sys-tems, but is better against aqueous acids.3.The epoxide groups react with nascentor existing hydroxyl groups, catalyzedby the acid, producing an ether linkage: OHC—OH + CH2—CH HC—O—CH2—CH OH9Table6Anhydrides†PHRD.E.R.33160-901Suggested CureSchedule2 hrs at 90°C + 4 hrs at 165°C + 16 hrs at 200°C2 hrs at 100°C + 2-6 hrs at 150°CCuring AgentNadic methyl anhydride (NMA)Hexahydrophthalicanhydride (HHPA)CommentsLiquid anhydride having long pot life at room temp.Excellent elevated temp. properties.Low melting point solid, approx. 35°C, soluble in liquidresin at room temp. Used in potting, filament windings, andclear castings.Good electrical properties, good high temperature properties. Reacts rapidly at high temperatures.Liquid anhydride. Imparts flexibility to cured composition.60-751Trimellitic anhydride(TMA)Dodecenyl succinicanhydride (DDSA)Phthalic anhydride (PA)Methyl hexahydrophthalic anhydride (MHHPA)Tetrahydrophthalicanhydride (THPA)60-90124 hrs at 150-180°C95-13012 hrs at 100°C + 4-6 hrs at 150°C40-6524 hrs at 120°C or 8 hrs at 150°CSolid anhydride with melting point 128°C. Low exothermand long pot life. Used in large encapsulations.Excellent light stability, fast gel time.60-7513 hrs at 100°C + 6 hrs at 140°C60-75124 hrs at 120°C or 8 hrs at 150°CSolid anhydride with melting point of 100°C. Similar tohexahydrophthalic anhydride in cured resin properties.Used in pottings and encapsulations.Liquid anhydride with higher reactivity than NMA but similar cured physical properties.Methyl tetrahydrophthalic anhydride (MTHPA)70-9012 hrs at 90°C + 4 hrs at 150°C1Plus suitable accelerator.†Typical formulations and cure schedules only; not to be construed as specifications.PolyamidesThis class of compounds can be consid-ered as modified polyfunctional aliphaticamines, since the polyamides mostwidely used are the condensation products of dimerized fatty acids and adifunctional amine such as ethylenedi-amine. Their theorized structure is represented as follows: O OOH——C—R—C—NH—CH2—CH2—NH—— Hn = 5 to 15nThe reactivity of polyamides with epoxies is similar to that of the aliphaticamines. Since the polyamides are relatively large polymers, the ratio ofpolyamide to epoxy is less critical thanwith the low-molecular-weight amines. Itis varied quite broadly to obtain proper-ties from hard to semi-flexible. In thissense, the polyamides can be consideredresin modifiers as well as curing agents.Polyamide-cured formulations havelonger pot life than formulations curedwith aliphatic polyamines and theiradducts. They cure at room temperaturewithout blushing and show outstandingadhesion. Formulations are high in vis-cosity and are sometimes incompatiblewith the resin until reaction has beeninitiated. They are usually dark in color.Polyamide systems lose structuralstrength and insulation value rapidlywith increasing temperatures, and areusually restricted to applications under65˚C (149˚F). Similar products from twopolyamide curing agent producers areshown in Table 7.10Table7Polyamides†PHRD.E.R.33170-110Suggested CureScheduleRT + several days to full cure.Curing AgentVersamid1100Ancamide2100CommentsSemi-solid polyamide resin used primarily as a solvent cut solutionto cure intermediate-molecular-weight epoxy resins in coatingapplications. Also available in solutions. Can be used to cure resinson wet substrates.High-viscosity fluid polyamide. Can be used at 100% solids bywarming to reduce viscosity. Used in laminates, adhesives, potting,sealants, and coatings. Also available in solution.Intermediate-viscosity fluid polyamide. Can be blended at RT orwarmed slightly to reduce viscosity. Used in wet lay-ups, adhe-sives, potting, sealants, coatings, epoxy mortars, and tooling.Low-viscosity polyamide having higher heat distortion, excellentadhesion, and low shrinkage. Used in 100% solids spray applica-tions, wet lay-ups, epoxy mortars, casting, tooling, and adhesives.Versamid 115Ancamide 22060-100RT gel + several days to full cureor 1-2 hrs at 100°C.Versamid 125Ancamide 260A50-100RT gel + several days to full cureor 1-2 hrs at 100°C.Versamid 140Ancamide 350A30-70RT gel + several days to full cureor 1-2 hrs at 100°C.RT = Room Temperature†Typical properties; not to be construed as specifications.12Trademark of HenkelTrademark of Air Products and Chemicals, Inc.Catalytic Curing AgentsCatalytic curing agents are those com-pounds that promote epoxy-to-epoxy orepoxy-to-hydroxyl reactions and do notthemselves serve as direct cross-linkingagents. Tertiary amines, amine salts,boron trifluoride complexes,and amineborates are in this class.The mechanism of epoxy-to-epoxy polymerization using a tertiary aminecatalyst (or other catalytic curing agent)theoretically takes place as follows:1. Opening of the epoxy group: OR3N + CH2—CH R3N — CH2—CH O⍜ OCH2—CH + CH2—CH O⍜CH2—CH O CH2—CH O⍜latent catalysts, such as BF3· MEA(boron trifluoride monoethylamine)complex or dicyandiamide. The latentcatalysts depend on dissociation by heatwith the dissociation products capable ofinitiating epoxy cures.The amount of catalyst used may varyfrom 2 to 10 phr. The specific amountfor a given system should be determinedexperimentally to develop the optimum in properties desired. Tertiary amine catalysts are used, for example, in smallamounts to accelerate the cure of anhydride-epoxy or aromatic amine-epoxycombinations, and they are also used inconjunction with latent catalysts to attainvarious degrees of B-staging.Examples of catalytic curing agents are Benzyl Dimethylamine (BDMA), BF3Monoethylamine (BF3•MEA), Dimethyl Aminomethyl Phenol.This continues until a dense cross-linkedstructure containing the stable etherlinkages is formed.This oversimplified explanation does not consider the hydroxyl groups either present in the higher weight resinhomologs or introduced by resin modi-fiers and curing agents. While the stepsof the epoxy-hydroxyl reaction differ, theend structure is very similar to that postulated for the epoxy-epoxy reaction.Pot life is moderate (2 to 24 hours) fortertiary amine and amine salts, and isvery long, up to several months, for the2. The ion thus formed is capable ofopening another epoxy group:11REACTIVEDILUENTS,MODIFIERS,FILLERSReactive DiluentsA reactive diluent is used primarily toreduce viscosity. Adding a reactive dilu-ent also permits higher filler loading andgives better wetting and impregnation.Preferably, the diluent should react withthe curing agent at approximately thesame rate as the resin, contribute sub-stantial viscosity reduction at low con-centrations, and be nonreactive with theresin under normal storage conditions.Reactive diluents in common use are†: OCH3—CH2—CH2—CH2—O—CH2—CH—CH2Epoxy resins may be modified for several reasons:• to enhance physical properties, suchas impact strength and adhesion,• to alter viscosity,• to improve pot life, lower exotherm, orreduce shrinkage, and• to lower the cost of the formulation.Butyl glycidyl ether produces maximumviscosity reduction. However, excessiveexposure to these products may presentserious health hazards. Consult productlabels and current Material Safety Data(MSD) sheets before using. The higher-molecular-weight reactive diluents — likethe C12-C14aliphatic ethers — are safer towork with, but not quiteas efficient.Figure 1 shows the viscosity-diluent concentration relationship for represen-tative DOW epoxy resins. The amount of curing agent, when used on a stoichiometric basis, should be adjustedfor the change in epoxide equivalentvalue of the diluent-modified resin. See “Calculation of StoichiometricRatios,” page 7.Butyl Glycidyl Ether (BGE)(Molecular weight — 130) OR—O—CH2—CH—CH2R = C12 to C14C12-C14Aliphatic Glycidyl Ether(Molecular weight — 242-270) O—O—CH2—CH—CH2H3CCresyl Glycidyl Ether (CGE)(Molecular weight — 165) C2H5 OCH3(CH2)3CHCH2OCH2CH—CH22 — Ethylhexyl Glycidyl Ether(Molecular weight — 186)†Typical diluents only; not to be construed as a recommendation from Dow.12Figure 1: Effect of Diluents on D.E.R. Epoxy Resins†100,000Resin ModifiersResin modifiers are used to improvemechanical and thermal shock resis-tance, increase elongation, and obtainhigher impact strength and flexibility.Usually there is some sacrifice of physi-cal strength, electrical properties, chem-ical or solvent resistance, or elevatedtemperature performance.Epoxy compounds, such as the aliphatic diepoxides (D.E.R. 732 andD.E.R. 736 flexible epoxy resins), ormonofunctional epoxide compounds(such as C12- C14Glycidyl Ether) areexamples of reactive epoxide-type modifiers. Such compounds can be usedat ratios up to 1:1 to obtain a flexiblecured composition. They have the addedadvantage of being shelf stable whenblended with the resin.The low viscosity and light color ofD.E.R. 732 and D.E.R. 736 resins offerviscosity reduction in epoxy formula-tions without affecting color of curedcompositions. These advantages are not found with most other flexibilizers.Figure 2 shows the effect on viscosity ofincreasing amounts of flexible resin inblends with D.E.R. 331.D.E.R. 331 andD.E.R. 73210,000D.E.R. 337 and CGEViscosity, cps1,000D.E.R. 337 and BGED.E.R. 331 and CGED.E.R. 331 and C12-C14 Aliphatic Glycidyl EtherD.E.R. 331 and 2-Ethylhexyl Glycidyl Ether100D.E.R. 331 and BGE105 10 15 20 25% DiluentFigure 2: Viscosity vs Flexible ResinConcentration (D.E.R. 331with D.E.R. 732 andD.E.R. 736)100,00010,000Viscosity, cps at 25°C1,000100D.E.R. 331 andD.E.R. 736100 20 40 60 80 100% Flexible Resin†For illustrative purposes only; not to be construed as specifications.Modifiers which may be reactive as curing agents are often used. Commonamong these are polysulfide polymers,triphenyl phosphite, and variouspolyamides. The latter react readily withthe epoxy and were discussed under“Curing Agents,” page 6. The polysulfidepolymers react slowly with the epoxieswhen used alone. One to three phr of anactive catalytic amine or an amine salt,such as 2,4,6 Tri (DimethylAminomethyl) Phenol, are used to accelerate cure.13Triphenyl phosphite reduces viscosityand lowers cost. Ratios up to 25 phrappear to have no gross effect on roomtemperature physical properties.Triphenyl phosphite, although reactivewith the epoxy, is not an effective curingagent by itself. A polyfunctional curingagent is necessary to effect a cure.About 75% of the normal stoichiometricamount of amine gives optimum resultswhen 25 phr triphenyl phosphite is usedwith a resin such as D.E.R. 331.Nonreactive modifiers are not used exten-sively, as they cause reduction in curedresin properties. When used, their morecommon function is to lower cost.Materials such as dibutyl phthalate,nonylphenol, pine oil, and glycol ethersmay be used. Chief requisites are thatthey be compatible with the resin beforeand after cure, not vaporize or foam dur-ing cure, and not migrate excessivelyfrom the cured composition.Fillers†The use of fillers in epoxy compositionscan lower costs, reduce exotherm,extend pot life, and achieve improve-ment in one or more of the cured resinproperties indicated:•Improved machinabilitypowdered aluminum or coppercalcium carbonatecalcium silicate•Improved abrasion resistancealuminaflint powdercarborundumsilicamolybdenum disulfide•Improved impact strengthchopped glassother fibrous materials•Improved electrical propertiesmicasilicapowdered or flaked glass•Improved thermal conductivitymetallic fillerscoarse sandalumina•Improved anti-settling, flow, orthixotropic propertiescolloidal silicasclaysSuch improvements are usuallyachieved at the sacrifice of tensile, flexural, and impact strength (whengranular fillers are used). Most fillersreduce the coefficient of thermal expansion and shrinkage in proportionto the amount of filler rather than thetype of filler used.Fibrous and flake fillers, such aschopped glass strand, glass flake, andmica, impart high viscosities at low fillerloadings (10 to 25 phr). Medium-weightgranular fillers, such as powdered alu-minum, alumina, and silica, may be usedat loadings up to 200 phr. Heavy fillers,such as powdered iron, iron oxide, andcoarse sand, may be loaded at ratios upto 800 phr.The finer particle size fillers are easierto incorporate, and have less tendencyto settle. Coarse and heavy fillers tend tosettle and cake on standing unless somelight-weight filler or anti-settling agent isalso incorporated. Fumed silica com-pounds are effective as anti-settling andthixotropic agents.†Typical fillers only; not to be construed as a recommendation from Dow.14TECHNIQUESThe full advantages of using epoxyresins, particularly in high volume applications, depend on the total formulation — resin, curing agent, etc.—and on the proper formulation processingtechniques.Each application has its unique perfor-mance requirements. However, somespecial considerations are common tomany applications, and a knowledge ofthem is essential in determining practical solutions.Some of these considerations are:•Establishing and maintaining safe handling and disposal procedures tomaximize worker and plant safety.•Preparing (quickly and easily) theright amount of thoroughly mixed formulation at the correct curingagent/resin ratio.•Avoiding excessive exotherm, prema-ture gelling, and waste of batch mixes.•Eliminating air entrapment in cast-ings, laminations, and adhesive joints.•Preventing spillage and subsequentproblems of toxicity exposure andcleanup.EPOXYFORMULATINGViscosity vs Temperature ofD.E.R. Liquid Epoxy ResinsFigure 3 shows viscosity curves ofD.E.R. liquid resins over a practicalrange of temperatures. Reducing viscosi-ty by elevating temperature helps incor-porate higher filler loadings and aids indeaerating mixes. It also assists the dis-solving and thorough mixing of solid orhigh viscosity curing agents.Figure 4 is a plot of the viscosity of twoconcentrations of each flexible resinwith D.E.R. 331 resin (a liquid bisphenol Atype epoxy resin) through a temperaturerange of 0 to 100°C.curing agents is possible, since resinand curing agent are mixed and deliv-ered almost instantaneously to the pointof application. Also, heat can be appliedto reduce viscosity and/or shorten curetime, or the components can be de-airedfor those applications where a bubble-free mix is required. Equipment is alsoavailable to dispense product directlyinto evacuated molds. The use of suchequipment minimizes the need for directcontact with the materials. Viscosity, cpsBatch mixing may be done in conven-tional paint or mortar mixing equipment.Figure 3: For laboratory or small batch mixes, dis-Viscosity vs Temperature for posable containers and portable stirringD.E.R. Liquid Epoxy Resins†equipment are adequate. Take care toensure thorough mixing.Uncatalyzed or over-catalyzedareas in a poor mix may resultD.E.R. 330in a non-uniform cure and poorperformance. Note: Batch mix-D.E.R. 331ing requires special care to10,000prevent exposure of employeesD.E.R. 337to resins, hardeners, etc. See“Hazards,” page 36.Temperature Control1,000EquipmentSeveral types of automatic mixing anddispensing equipment are commerciallyavailable. Use of adequately engineeredequipment makes it possible to meter,mix, and deliver automatically the rightamount of formulation. The mix is uni-form, and the changes in viscosity thatoccur when batch mixes start to reactare avoided. The use of very fast Where large batches of moder-ately reactive mixes (thosewith a pot life of several hoursD.E.R. 332100or days) are necessary, coolingand circulation facilities shouldprolong pot life. This techniqueis particularly adaptable to lowviscosity formulations forimpregnating, dipping, etc. Pot020 40 60 80 100 120life may be further prolongedTemperature, °Cby stepwise addition of freshmix to the resin tank. This also serves to†For illustrative purposes only; not to be construed asspecifications.control viscosity as the batch ages.15Figure 4: Viscosity vs Temperature (Blends ofD.E.R. 732 and D.E.R. 736 with D.E.R. 331)100,00010,000RESINPERFORMANCEDATATables 10 through 30 show typi-cal properties of unfilled castingswith the Dow liquid epoxy resinscured by D.E.H. 24 (TETA), BE3 •MEA, NMA, etc. No optimization of curing agents, phr ratios, or cure schedules was made.Generally, 10% to 30% of DOW flexibleepoxy resin is a good starting pointrange to improve resilience while retaining most of the desirable properties of the unmodified system.With this level of modification, elongation, impact and sometimes tensile strength are increased while flexural and compressive strengths are decreased.D.E.R. 732 resin or D.E.R. 736 resin are often favored at the lower levels of modification because of the viscosityreduction they provide. Heat distortiontemperatures are lower with increasingamounts of flexible resin. Solvent andchemical resistance may lessen, depend-ing on the system and type of exposure.Electrical properties are essentially unaffected at room temperatures, but are likely to fall off at elevated temperatures.In cured systems containing 50% ormore of DOW flexible epoxy resins, ten-sile, flexural, and compressive strengthsare lowered substantially, and impactresistance and elongation are greatlyincreased (compared to those propertiesin unmodified epoxy resins). D.E.R. 736resin, with its shorter chain length, hasless effect on physical properties at agiven flexible resin content than doesD.E.R. 732 resin.30% D.E.R. 73270% D.E.R. 3311,000Viscosity, cpsThe specific curing agents select-ed were chosen because each istypical of its class and is in com-D.E.R. 331mon use. Curing agents of 50% D.E.R. 732100similar chemical structure can be50% D.E.R. 331expected to give similar 50% D.E.R. 736performance, when recommend-50% D.E.R. 331ed adjustments of ratio and cureschedule are followed.30% D.E.R. 73670% D.E.R. 331Dow flexible epoxy resins, when10used alone, develop soft cured0 20 40 60 80 100compositions having low physicalTemperature,°Cstrength properties. Therefore,*Trademark of The Dow Chemical Companythey are best utilitzed in blends withbisphenol A/epichlorohydrin resinssuch as D.E.R. 331 resin or an epoxynovolac resin such as D.E.N. 438* resin.Liquid, semi-solid, or low molecularweight solid epoxy resins also may beused. The amount of flexible resinrequired is dependent on the end useapplication and the desired properties of the formulation.16The cure schedules and formulatingtechniques used in preparing specimensfor physical property testing are shownin Table 9. The cure schedules are notnecessarily optimum, but are used asstandard conditions to allow direct com-parison with data on other Dow epoxyresins listed in other bulletins.The test methods given in Table 8 wereused in obtaining the data in Tables 10and 12.Test MethodsWhen comparing Dow data with datafrom other sources, consider themethod of test. For example, Dow flexural strength data were obtained oncoupons 1/4\"thick by 1/2\"wide using aspan of 4\". If the coupon size is reducedto 1/8\"thick and the span is reduced to2\", values for flexural strengths will typically be 2,000 to 5,000 psi higher forthe same formulation.Whenever possible, all data were gath-ered by the ASTM procedures listed inTable 8, page 17. Procedures are givenwhere an ASTM test was not used. Chemical And Solvent ResistanceBecause of the great number of samples involved, chemical and solventresistance data were limited to inorganicand organic acids and bases, commonsolvents, oxidizing agents, and water.Amine, anhydride, and catalytic-curedsystems were extensively exposed toshow the effect of the type of catalyst on resistance. All formulations wereexposed to a limited number of reagents to compare the effect of molecular weight change and diluents.Table8Test MethodsTest MethodsASTM D 8ASTM D 790Sample Size and Comments1/2\" x 1/2\" bars; span 4\"1/2\" W x 1/4\" D bars; span 4\"PropertyHeat Distortion TemperatureFlexural Strength and ModulusYield Compressive Strength and Modulus at 10% Deformation or LessTensile Strength and Ultimate ElongationASTM D 695ASTM D 6381/2\" x 1/2\" x 1\" barsDimensions per ASTM designation: F = 2.25\" T = 0.125\" W = 0.500\"D = 4.5\"rate 0.2\"/min.1/4\" thick coupons1/2\" x 1/2\" x 2 1/2\" bars3\" x 1\" x 0.125\" coupons2\" dia. x 0.125\" coupons exposed in air convection oven at specified temperature.Cond. A: Samples conditioned 40 hrs at 23°C and 50% relative humidity. Cond. C: Samples conditioned 48 hrs at 50°C. Cond. D: Samples conditioned 96 hrs at 23°C and 96% relative humidity.—Determined on 500 gm samples. Tests initiated at elevated temperature were maintained in constant temperature bath or oven.Hardness, Rockwell MIzod Impact StrengthChemical and Solvent ResistanceThermal DegradationDielectric Constant and Dissipation FactorASTM D 785ASTM D 256ASTM D 543—ASTM D 150Volume and Surface ResistivityPot Life and Peak ExothermASTM D 257—17The following cure schedules were used in preparing test specimens for the data presented in Tables 12 through 33.Table9Cure Schedules†Initial GelTimeHrs16Post CureTimeHrs2Curing AgentD.E.H. 20 (diethylene triamine)D.E.H. 24 (triethylene tetramine)Nadic Methyl Anhydride1Temp°C25Temp°C100CommentsFor high viscosity resins; both resins and molds preheatedto 55°C to reduce viscosity.For high viscosity resins; both resins and molds preheatedto 55°C to reduce viscosity.Resin, curing agent, and molds preheated to 90°C.162531002904 +1616165 200150BF3Monoethylamine (BF3• MEA)Versamid 140 2(polyamide)4100Resin preheated to 80-100°C to dissolve catalyst. Molds preheated to 100°C.Resins and curing agent preheated to 55°C to reduce viscosity. Molds preheated to 65°C to permit release ofentrapped bubbles. Higher viscosity resins may requirehigher mix temperatures.For high viscosity resins, molds preheated to 55°C toreduce viscosity. Ideal post cure includes several hours at 150°C.For high viscosity resins; both resins and molds preheatedto 55°C to reduce viscosity.For high viscosity resins; both resins and molds preheatedto 55°C to reduce viscosity.162531001,2-Cyclohexane Diamine (cycloaliphatic amine)16252100D.E.H. 20 (diethylene triamine)D.E.H. 39 (aminoethyl piperazine)16252100162546011.5 parts Benzyldimethylamine (BDMA) as accelerator per one hundred parts resin.2Polyamide from Henkel.†For illustrative purposes only; not to be construed as specifications.18Table10Physical Properties — DOW Liquid Epoxy Resins Cured with D.E.H. 24†30% D.E.R. 73270% D.E.R. 33121811540————5810,8253.2512,2002.996,6005.53.548730% D.E.R. 73670% D.E.R. 33119213400————7614,4004.2112,0403.519,2256.00.6191ResinAverage Epoxide Equivalent WeightphrFormulation Viscosity, cps at 25°CReactivity & Exotherm (Min.)1 of a 500 Gram Mass(°C)2(@ 25°C)(°C)3 (Min.)4 Heat Deflection Temperature (°C)Flexural Strength (psi)Flexural Modulus (psi x 105 )Yield Compressive Strength (psi)Compressive Modulus (psi x 105 ) at10% deformation or lessTensile Strength (psi)Ultimate Elongation, %Izod Impact Strength (ft. lb./in. notch)Hardness (Rockwell M)D.E.R.36219513.21,00031802704410017,0005.5116,0003.5010,3003.4—107D.E.R.33018013.51,25040802715510417,7004.9015,0003.408,9502.80.40107D.E.R. 33119013.02,25025742663611113,9004.416,3004.411,4004.40.50106D.E.R. 33217414.090043682835510715,5904.0515,8402.639,6204.40.50107D.E.R.31719712.23,20025752704010417,0004.7414,5004.0610,7002.70.50109D.E.R.383180131,65040882705510017,0005.015,8003.3710,9003.10.501071Time to transition point or gel.2Temperature at transition point.3Temperature at peak exotherm.4Time to peak exotherm.†Typical values; not to be construed as specifications.19Table11Electrical Properties – DOW Liquid Epoxy Resins Cured with D.E.H. 24†D.E.R.330D.E.R. 331D.E.R. 332D.E.R. 317D.E.R. 38330% D.E.R. 73270% D.E.R. 33130% D.E.R. 73670% D.E.R. 331ResinDielectric Constant Cond. A Frequency, Hz 60 103106Cond. D Frequency, Hz 60 103106Dissipation Factor Cond. A Frequency, Hz 60 103106Cond. D Frequency, Hz 60 103106Volume Resistivity (ohm—cm) Cond. A Cond. CSurface Resistivity (ohm) Cond. A Cond. C3.97 3.86 3.394.24 4.13 3.524.02 3.90 3.424.27 4.17 3.553.98 3.86 3.274.23 4.07 3.424.02 3.95 3.434.21 4.12 3.54— 4.31 —— — —3.87 3.76 3.273.92 4.53 3.693.95 3.85 3.324.58 4.32 3.58.009.020 .029.023 .025 .0331.51 x 10151.76 x 10151.73 x 10143.14 x 1014.007 .020 .032.010 .023 .0366.1 x 1015 1.7 x 10157.85 x 10156.3 x 1015.010 .027 .031.013 .030 .0351.29 x 10151.1 x 10157.85 x 10149.42 x 10140.008 0.018 0.0340.010 0.020 0.0361.18 x 10158.5 x 1014>7.85 x 10157.85 x 1014— 0.019 —— — —1.58 x 1015—2.22 x 1015—.014 .022 .032.074 .045 .0511.97 x 10154.43 x 10153.14 x 10152.04 x 1013.013 .023 .033.043 .037 .0431.24 x 10151.79 x 10143.94 x 1015 7.22 x 1013–– = Not Determined†Typical values; not to be construed as specifications.20Table12Chemical, Solvent Resistance, and Thermal Degradation —DOW Liquid Epoxy Resins Cured With D.E.H. 24†30% D.E.R. 73270% D.E.R. 331% WTChange, Days7 28 1201.10 4.26 9.312.21 4.54 9.935.42 10.60 26.402.39 4.92 10.40D1— — 3.21 6.69 15.20.85 1.85 3.75— — —14.30 D —4.95 9.78 20.40D — —D — —3.31 10.10 24.10.02 .01 .02.68 1.39 2.67.02 .04 .241.09 2.16 4.30–3.17 –12.10 –34.40.92 1.93 3.80100 200 300 50030% D.E.R. 73670% D.E.R. 331% WTChange, Days7 28 1201.81 3.61 7.901.90 4.03 9.383.54 6.11 15.302.00 4.11 9.24D — —2.21 4.69 10.60.56 1.37 3.10— — —10.86 D —1.49 3.03 6.454.28 10.50 —10.00 D —.03 .10 .81 —.01 .00 .05.48 1.03 2.23.03 .04 .22.71 1.48 3.24–1.60 –6.43 –19.80. 1.36 3.11100 200 300 500ResinReagentSulfuric Acid 30%Sulfuric Acid 3%Hydrochloric Acid 36%Hydrochloric Acid 10%Nitric Acid 40%Nitric Acid 10%Ammonium Hydroxide 28%Ammonium Hydroxide 10%Acetic Acid 25%Ethyl Alcohol 95%AcetoneEthylene DichlorideTolueneSodium Hydroxide 50%Sodium Hydroxide 10%JP 4 FuelCitric Acid 10%Chromic Acid 40%Distilled WaterHRSThermal Degradation (% Wt. Loss) 160°C210°CD.E.R. 330% WTChange, Days7 28 120.56 1.24 2.85— — —— — —— — —— — —— — —— — —— — —— — —— — —.17 .74 4.48— — —— — —0.00 -.06 -.11— — —.03 -.01 .09— — —— — —.40 .79 1.68100 200 300 500D.E.R. 331% WTChange, Days7 28 120.69 1.8 3.10.61 1.27 2.661.13 2.35 5.580. 1.45 3.15 1.9 4.1 D.81 1.77 3.95 .35 .84 1.79.37 .81 1.732.99 6.14 14.2.14 .37 .86.45 2.1 7.7.29 1.14 6.43.04 .07 .16.0 .04 .02.36 .66 1.41.02 -.01 .09.39 .80 1.65–1.53 –5.82 –17.3.41 .88 1.7100 200 300 500D.E.R. 332% WTChange, Days7 28 120.62 1.33 3.08— — —— — —— — —— — —— — —— — —— — —— — —— — —.19 .80 4.68— — —— — —–.01 –.05 –.07— — —.02 -.02 .08— — —— — —.41 .80 1.69100 200 300 500D.E.R. 317% WTChange, Days7 28 1200. 1.27 2.80— — —— — —— — —— — —— — —— — —— — —— — —— — —0.83 3.11 7.80— — —— — —–0.02 –0.07 –0.11— — —0.14 0.20 -0.21— — —— — —0.43 0.77 1.78100 200 300 500D.E.R. 383% WTChange, Days7 28 120.66 1.31 2.94 — — —1.86 3.15 6.53 — — —4.24 D D— — —— — —— — —— — —— — —.92 3.62 12.0— — —.20 .21 .24.03 -.10 -.13— — —— — —— — —— — —.38 .76 1.40100 200 300 500.95 .95 1.32 1.412.11 3.77 — 7.39.71 1.0 1.4 1.63.4 5.4 6.8 7.8.92 .96 1.07 1.422.07 3.51 — 7.000.70 1.2 1.4 1.73.30 5.2 7.0 7.71.1 1.3 1.6 1.83.9 5.5 6.9 9.21.83 2.47 2. 3.274.73 D — —1.50 2.11 2.57 3.41D D — —D = Decomposed— = Not Determined†Typical values; not to be construed as specifications.21TableResin13Physical Properties — DOW Liquid Epoxy ResinsCured with 1,2-Cyclohexane Diamine†D.E.R. 331190171,020501131725611015,4004.216,0003.910,3004.00.40106D.E.R. 383180167009511817610311015,2004.115,8004.012,1004.10.4010Time to peak exotherm.†Typical values; not to be construed as specifications.Average Epoxide Equivalent WeightphrFormulation Viscosity, cps at 25°CReactivity & Exotherm (Min.)1of a 500 Gram Mass (°C)2(@25°C)(°C)3(Min.)4Heat Deflection Temperature (°C)Flexural Strength (psi)Flexural Modulus (psi x 105 )Yield Compressive Strength (psi)Compressive Modulus (psi x 105 ) at10% deformation or lessTensile Strength (psi)Ultimate Elongation (%)Izod Impact Strength (ft. lb./in. notch)Hardness (Rockwell M)1Time to transition point or gel.2Temperature at transition point.3Temperature at peak exotherm.TableResin14Electrical Properties — DOW Liquid Epoxy ResinsCured with 1,2-Cyclohexane Diamine†D.E.R. 331D.E.R. 383Dielectric Constant Cond. A. Frequency, Hz 103Dissipation Factor Cond. A. Frequency, Hz 103Volume Resistivity (ohm-cm) Cond. ASurface Resistivity (ohm) Cond. A†Typical values; not to be construed as specifications.4.504.35.01.0 x 10155.6 x 1015.0084.2 x 10155.9 x 101522Table15Chemical, Solvent Resistance, and Thermal Degradation— DOW Liquid Epoxy Resins Cured with 1,2-Cyclohexane Diamine†D.E.R. 331% WT Change, Days7.674.111.76.32.082.29.1001.43.8281.2017.15.80.48-.344.41.952001.65.61202.25D21.3.57-.098.941.623001.97.35002.09.9D.E.R. 383% WT Change, Days7.573.272.45.66-.162.10.471001.33.828.9.8310.21.70.083..2001.55.81201.85D25.04..026.151.383001.77.25001.79.7ResinReagentSulfuric Acid 30%Nitric Acid 40%AcetoneTolueneSodium Hydroxide 50%Hydrochloric Acid 36%Distilled WaterHRSThermal Degradation (% Wt. Loss) 160°C210°CD = Decomposed†Typical values; not to be construed as specifications.23Table16Physical Properties — DOW Liquid Epoxy Resins Cured with Nadic Methyl Anhydride†30% D.E.R. 73270% D.E.R. 33121887.527.5————8716,7004.4517,7302.1410,05.5.4710830% D.E.R. 73670% D.E.R. 33119287.525————11616,4004.3516,1502.8211,5706.2.41106ResinAverage Epoxide Equivalent WeightphrFormulation Viscosity, cps at 80°CReactivity & Exotherm (Min.)1 of a 500 Gram Mass(°C)2(@ 80°C)(°C)3(Min.)4Heat Deflection Temperature (°C)Flexural Strength (psi)Flexural Modulus (psi x 105 )Yield Compressive Strength (psi)Compressive Modulus (psi x 105 ) at10% deformation or lessTensile Strength (psi)Ultimate Elongation, %Izod Impact Strength (ft. lb./in. notch)Hardness (Rockwell M)1Time to transition point or gel.2Temperature at transition point.3Temperature at peak exotherm.D.E.R.33018087.53515811313218014819,2004.7016,9003.846,3401.40.30111D.E.R.33119087.5381299914615315614,0004.4018,3004.4010,0002.50.48111D.E.R. 33217487.530979315212513521,2004.7220,1903.406,2601.60.21114D.E.R. 33724087.522537921536511118,8703.5218,9403.247,3300.90.49113D.E.R.31719787.5458010015510014715,0004.4115,0004.417,0001.80.481.09D.E.R.38318087.53616011213018214418,5004.8017,1003.807,0001.70.301124Time to peak exotherm.†Typical values; not to be construed as specifications.24Table17Electrical Properties — DOW Liquid Epoxy Resins Cured with Nadic Methyl Anhydride†D.E.R.330D.E.R. 331D.E.R. 332D.E.R. 337D.E.R. 317D.E.R. 38330% D.E.R. 73270% D.E.R. 33130% D.E.R. 73670% D.E.R. 331ResinDielectric Constant Cond. A Frequency, Hz 60 103106Cond. D Frequency, Hz 60 103106Dissipation Factor Cond. A Frequency, Hz 60 103106Cond. D Frequency, Hz 60 103106Volume Resistivity (ohm—cm) Cond. A Cond. CSurface Resistivity (ohm) Cond. A Cond. C3.15 3.13 3.013.39 3.35 3.143.15 3.14 2.973.34 3.32 3.113.14 3.12 2.993.30 3.29 3.133.36 3.33 3.103.46 3.43 3.153.12 3.09 2.3.22 3.19 3.01— 3.54 —— — —3.20 3.18 2.984.27 3.32 3.093.19 3.17 3.003.36 3.36 3.12.0030 .0054.016.0079 .0063 .020.0020 .0054 .017.0023 .0059 .021.0049 .0045 .015.0030 .0044 .018.0037 .0060 .027.0035 .0067 .028.0024 .0053 .018.0038 .0059 .020— .0038 —— ——.0061 .0066 .021.0060 .076 .025.0053 .0069 .020.0061 .0078 .0266.11 x 10153.67 x 10156.1 x 10151.17 x 10157.2 x 10151.01 x 10157.3 x 10152.9 x 10159.0 x 10144.74 x 10146.15 x 1015—4.71 x 10154.71 x 10151.73 x 10151.24 x 10154.71 x 10153.93 x 10153.93 x 10153.93 x 10166.28 x 10151.1 x 1015>7.85 x 10153.93 x 1015>7.85 x 10153.93 x 10154.95 x 1015—3.53 x 10157.85 x 10157.85 x 10152.67 x 1014–– = Not Determined†Typical values; not to be construed as specifications.25Table18Chemical, Solvent Resistance, and Thermal Degradation —DOW Liquid Epoxy Resins Cured with Nadic Methyl Anhydride†D.E.R. 330% WTChange, Days7 28 120.33 .48 .54 — — —D.E.R. 331% WTChange, Days7 28 120.33 .83 .55D.E.R. 332% WTChange, Days7 28 120.28 .41 .51D.E.R. 337% WTChange, Days7 28 120.29 .57 1.14— — —D.E.R. 317% WTChange, Days7 28 1200.41 0.66 1.20— — —D.E.R. 383% WTChange, Days7 28 120.14 .22 .36— — —30% D.E.R. 73270% D.E.R. 331% WTChange, Days7 28 120.23 .52 .77— — —30% D.E.R. 73670% D.E.R. 331% WTChange, Days7 28 120.35 .53 .56— — —ResinReagentSulfuric Acid 30%Sulfuric Acid 3%Hydrochloric Acid 36%Hydrochloric Acid 10%Nitric Acid 40%Nitric Acid 10%Ammonium Hydroxide 28%Ammonium Hydroxide 10%Acetic Acid 25%Ethyl Alcohol 95%AcetoneEthylene DichlorideTolueneSodium Hydroxide 50%Sodium Hydroxide 10%JP 4 FuelCitric Acid 10%Chromic Acid 40%Distilled WaterHRSThermal Degradation (% Wt. Loss) 160°C210°C260°C.50 .81 .96.32 .56 1.36.41 . .85.26 .46 1.11— — —— — —— — —.21 .38 .88— — —— — —— — —— — —— — —— — —— — —— — —— — —3.77 12.20 21.60— — —— — —–.02 –.13 –.21— — —.02 –.02 .12— — —— — —.47 .74 .86100 200 300 500.42 .66 .78.40 1.1 1.7.47 .81 .94.67 1.24 1.84.59 1.06 1.36.46 .73 .90.20 .37 .594.8 13.0 22.36.73 D —.06 .09 .28–.08 –.12 –.16.37 .51 .50.02 .02 .16.50 .79 .94.07 –.62 –2.14.52 .82 .87100 200 300 500.30 .53 .66.36 .99 5.38.40 .66 .83.57 1.09 1.78.60 .97 1.28.45 .63 .84.11 .22 .371.07 17.70 D9.81 D —.02 .04 .24–.30 –.83 –1.45.34 .54 .68.02 .02 .13.41 . .85.07 –.96 –3.44.40 .61 .84100 200 300 500— — —— — —— — —— — —— — —— — —— — —6.13 D —— — —— — —–.04 –.08 –.25— — —.01 .03 .19— — —— — —.41 .90 1.79100 200 300 500— — —— — —— — —— — —— — —— — —— — —6.29 17.1 D— — —— — —0.05 0.04 0.05— — —0.14 0.26 0.30— — —— — —0.59 0.96 1.30100 200 300 500— — —.20 .65 3.41— — —— — —— — —— — —— — —2.33 5.62 18.8— — —.10 .14 .18–.16 –.26 –.26— — —— — —— — —— — —.26 .54 .70100 200 300 500— — —— — —— — —— — —— — —— — —— — —D — —— — —— — —–.01 –.01 –.01— — —.02 .02 .18— — —— — —.45 .83 1.40100 200 300 500— — —— — —— — —— — —— — —— — —— — —5.74 15.3 D— — —— — —–.02 –.05 –.07— — —.03 .02 .16— — —— — —.48 .80 1.02100 200 300 500.21 .13 .13 .16.28 .28 – .846.26 10.50 – –.12 .07 .10 .10.66 1.1 1.5 1.85.60 10.20 – –.27 .05 .09 .09.28 .31 – .765.10 9.30 – –.36 .27 .36 .362.38 2.59 – 3.1810.90 14.90 – –.35 .40 .40 .43.70 1.3 1.5 2.06.10 9.80 – –.17 .04 .09 .111.1 1.1 1.6 2.3– – – –.61 .45 .56 .56.77 2.58 – 2.5411.80 – – –.28 .22 .28 .221.02 1.44 – 2.8124.90 D – –D = Decomposed— = Not Determined†Typical values; not to be construed as specifications.26Table19Physical Properties — DOW Liquid Epoxy Resins Cured with BF3· MEA†D.E.R.33018033526010612932512112,200.4716,1003.484,620.1D.E.R. 33119034019011016024016814,5004.516,5003.35,7001.60.26111D.E.R. 33217433012511525314013013,4303.2116,9302.594,280.800.25112D.E.R. 3372403900380909343514811,9503.2114,7202.486,6201.70.4610930% D.E.R. 73270% D.E.R. 331218348————5912,0553.6910,6002.466,4257.8.548730% D.E.R. 73670% D.E.R. 331192345————7214,5804.4211,0002.8,9306.45.4995ResinAverage Epoxide Equivalent WeightphrFormulation Viscosity, cps at 100°CReactivity & Exotherm of a 500 Gram Mass(Min.)1(@100°C)(°C)2(°C/Min.)3(Min.)4Heat Deflection Temperature (°C)Flexural Strength (psi)Flexural Modulus (psi x 105 )Yield Compressive Strength (psi)Compressive Modulus (psi x 105 ) at 10% deformation or lessTensile Strength (psi)Ultimate Elongation (%)Izod Impact Strength (ft. lb./in. notch)0.30Hardness (Rockwell M)1Time to transition point or gel.2Temperature at transition point.3Temperature at peak exotherm.1104Time to peak exotherm.†Typical values; not to be construed as specifications.27Table2 0Electrical Properties — DOW Liquid Epoxy Resins Cured with BF3· MEA†D.E.R.330D.E.R. 331D.E.R. 332D.E.R. 33730% D.E.R. 73270% D.E.R. 33130% D.E.R. 73670% D.E.R. 331ResinDielectric Constant Cond. A Frequency, Hz 60 103106Cond. D Frequency, Hz 60 103106Dissipation Factor Cond. A Frequency, Hz 60 103106Cond. D Frequency, Hz 60 103106Volume Resistivity (ohm-cm) Cond. ACond. CSurface Resistivity (ohm) Cond. ACond. C3.43 3.40 3.223.70 3.66 3.393.47 3.45 3.233.71 3.70 3.413.36 3.34 3.153.59 3.58 3.313.36 3.33 3.163.71 3.68 3.323.46 3.40 3.133.27 4.08 3.503.54 3.48 3.204.34 3.82 3.43.0039 .0054 .022.0160 .0078 .0274.81 x 10151.68 x 10157.85 x 10151.26 x 1015.0029 .0053 .023.0039 .0068 .0348.6 x 10151.2 x 1016>7.85 x 1015>7.85 x 1015.0032 .0052 .023.0046 .0062 .0271.92 x 10152. x 10152.36 x 10152.36 x 1015.0040 .0068 .025.0071 .0083 .0355.1 x 10 151.78 x 10 15>7.85 x 10151.38 x 1015.0044 .012 .024.052 .031 .0477.52 x 10141.10 x 10144.71 x 10146.28 x 1015.00 .0097 .031.013 .014 .0413.77 x 10151.51 x 10151.57 x 10151.02 x 1015†Typical values; not to be construed as specifications.28Table21Chemical, Solvent Resistance, and Thermal Degradation — DOW Liquid Epoxy Resins Cured with BF3· MEA†30% D.E.R. 73270% D.E.R. 331% WTChange, Days7 28 12048 .88 1.29— — —30% D.E.R. 73670% D.E.R. 331% WTChange, Days7 28 120.36 .71 1.11— — —ResinReagentSulfuric Acid 30%Sulfuric Acid 3%Hydrochloric Acid 36%Hydrochloric Acid 10%Nitric Acid 40%Nitric Acid 10%Ammonium Hydroxide 28%Ammonium Hydroxide 10%Acetic Acid 25%Ethyl Alcohol 95%AcetoneEthylene DichlorideTolueneSodium Hydroxide 50%Sodium Hydroxide 10%JP 4 FuelCitric Acid 10%Chromic Acid 40%Distilled WaterHRSThermal Degradation (% Wt. Loss) 160°C210°C260°CD.E.R. 330% WTChange, Days7 28 12034 .73 1.13 — — —D.E.R. 331% WTChange, Days7 28 120.40 1.1 1.2D.E.R. 332% WTChange, Days7 28 12033 .53 1.05— — —D.E.R. 337% WTChange, Days7 28 120.21 .60 1.02— — —.52 1.05 1.66— — —.26 .49 1.17— — —— — —— — —— — —— — —— — —— — —— — —— — —— — —— — —.27 .84 4.00— — —— — —.01 –.04 .03— — —.03 .08 .23— — —— — —.51 .99 1.71100 200 300 500.44 .87 1.38.45 1.2 1.5.48 1.00 1.59.57 1.22 2.17.57 1.16 1.93.53 1.03 1.65.20 .43 .80.43 1.2 3.2.85 2.39 8.26.09 .17 .26–.03 –.02 0.00.50 .94 1.46.02 .06 .23.56 1.10 .169–.50 –2.42 –7.74.62 1.2 1.8100 200 300 500— — —— — —— — —— — —— — —— — —— — —.30 .93 4.67— — —— — —0.2 –.04 .01— — —.02 .05 .20— — —— — —.53 .99 1.57100 200 300 500— — —— — —— — —— — —— — —— — —— — —1.12 3.16 12.6— — —— — —–.03 –.04 –.02— — —–.01 .00 .16— — —— — —.60 1.18 1.92100 200 300 500— — —— — —— — —— — —— — —— — —— — —D — —— — —— — —.01 .05 .03— — —.03 .06 .27— — —— — —.75 1.54 2.68100 200 300 500— — —— — —— — —— — —— — —— — —— — —7.71 D —— — —— — —.02 .03 .04— — —04 .05 .28— — —— — —.56 1.12 2.04100 200 300 500.37 .41 .41 .571.42 1.87 – 3.3722.40 D – –.36 .48 .11 .862.6 4.0 4.9 5.519.60 D – –.25 .36 .41 .41.98 1.46 – 3.0520.80 D – –.54 .72 .80 1.071.65 2.45 – 3.6922.60 D – –4.44 5.72 6.63 7.813.50 15.20 – 18.044.10 D – – 2.40 3.32 4.09 4.8412.30 15.20 – 20.4043.00 D – – D = Decomposed— = Not Determined†Typical values; not to be construed as specifications.29TableResin22Physical Properties — DOW Liquid Epoxy Resins Cured with Polyamide6 Curing Agent†30% D.E.R. 73270% D.E.R. 3312184325 502,650 40030% D.E.R. 73670% D.E.R. 3311924325 502,550 310D.E.R. 3301804325 508,800 1,200D.E.R. 3311904325 5016,000 1,250D.E.R. 3321744325 506,500 960D.E.R. 3372404325 50— 62,000D.E.R. 3171974325 5081,200 1,370D.E.R. 3831804325 509,300 1,210Average EpoxideEquivalent WeightphrFormulation Viscosity, °CcpsReactivity & Exothermof a 500 Gram Mass(°C)1(Min.)2(°C)3(°C)4(Min.)5Heat DeflectionTemperature (°C)Flexural Strength (psi)Flexural Modulus (psi x 105 )Yield CompressiveStrength (psi)Compressive Modulus (psi x 105 ) at10% deformation or lessTensile Strength (psi)Ultimate Elongation (%)Izod Impact Strength (ft. lb./in. notch)Hardness (Rockwell M)25 50169 3053 80 228194448613,1003.8311,80025 5094 2256 90118 226110351019,7003.5012,40025 50160 3170 76153 2151854212,1703.2712,290—50— 16— 95— 172—258811,3302.1311,78025 50114 2570 92250 235130388312,3003.3112,20025 50169 3254 81 230194478313,0003.9212,100— —————————528,3502.4712,800— —————————5311,2503.3613,5002.957,6003.60.403.708,3003.90.50802.396,8102.00.44823.847,290–1.03723.118,9004.60.49862.928,0004.00.40871.744,83015.3.66602.236,8504.73.52741Initial temperature of mix.2Time to transition point or gel.3Temperature at transition point.4Temperature at peak exotherm.5Time to peak exotherm.6For example Versamid 140 or Ancamide 350 A. (Curing agent is a 350-400 amine value polyamide.)— = Not Determined– = Not run due to high viscosity.†Typical values; not to be construed as specifications.30TableResin23Electrical Properties — DOW Liquid Epoxy Resins Cured with Polyamide1Curing Agent†D.E.R.330D.E.R. 331D.E.R. 332D.E.R. 337D.E.R. 317D.E.R. 38330% D.E.R. 73270% D.E.R. 33130% D.E.R. 73670% D.E.R. 331Dielectric Constant Cond. A Frequency, Hz 60 103106Cond. D Frequency, Hz 60 103106Dissipation Factor Cond. A Frequency, Hz 60 103106Cond. D Frequency, Hz 60 103106Volume Resistivity (ohm-cm) Cond. ACond. CSurface Resistivity (ohm) Cond. ACond. C1 3.13 3.12 2.953.39 3.35 3.093.23 3.19 2.993.48 3.44 3.103.24 3.20 2.953.44 3.39 3.073.20 3.17 2.913.48 3.40 3.083.39 3.35 3.043.58 3.52 3.15— 3.76 — — — — 3.36 3.28 3.983.63 3.90 3.303.37 3.31 3.0.17 3.74 3.26.0045 .0065 .019.0098 .010 .022.0036 .0070 .019.0059 .011 .026.0097 .0097 .021.0078 .011 .026.0063 .0091 .021.0210 .014 .027.0047 .010 .020.0047 .010 .020— .0070 — — — — .011 .016 .024.058 .036 .044.010 .012 .021.055 .031 .0361.44 x 10157.68 x 10141.26 x 10151.26 x 10151.22 x 10161.22 x 10165.5 x 10157.85 x 10154.86 x 10152.91 x 10147.85 x 10152.04 x 10141.21 x 10161.45 x 10157.85 x 10151.33 x 10156.04 x 10153.62 x 1015>7.85 x 10151.57 x 10151.38 x 1015—2.40 x 1015—4.81 x 10152.53 x 10133.93 x 10159. x 10121.81 x 10151.04 x 10137.85 x 10154.0 x 1013For example Versamid 140 or Ancamide 350 A. (Curing agent is a 350-400 amine value polyamide.)— = Not Determined†Typical values; not to be construed as specifications.31Table24Chemical, Solvent Resistance, and Thermal Degradation — DOW Liquid Epoxy Resins Cured with Polyamide1Curing Agent†D.E.R. 330% WTChange, Days7 28 120.58 1.32 3.70— — —2.08 4.65 14.10— — —0.00 0.2 .11.03 .06 .34.47 1.03 2.36100 200 300 500.77 1.15 1.39 1.532.15 3.18 — 4.35D.E.R. 331% WTChange, Days7 28 120.67 1.9 3.61.7 3.8 6.63.4 7.3 16.21.5 3.7 8.0–.01 .07 .20.03 .05 .29.58 1.3 2.6100 200 300 500.73 1.1 1.4 1.62.9 4.2 5.0 5.6D.E.R. 332% WTChange, Days7 28 120.52 1.18 3.35— — —2.17 4.77 14.2— — —0.00 0.00 .07.02 .04 .23.47 .99 2.24100 200 300 500.50 .74 .95 1.071.61 2.44 — 4.08D.E.R. 337% WTChange, Days7 28 1201.05 3.10 7.08— — —5.79 13.04 D— — —.04 .03 .15.02 .06 .31.47 1.18 2.61100 200 300 5001.05 1.48 1.73 1.822.66 3.55 — 5.48D.E.R. 317% WTChange, Days7 28 1200. 1.27 3.51— — —3.49 6.87 15.4— — —–.02 –.07 –.10.23 .40 .59.62 1.14 2.40100 200 300 5001.01 1.30 1.62 1.712.80 3.91 4.97 5.50D.E.R. 383% WTChange, Days7 28 120.40 .74 1.502.86 0 0— — —6.61 17.4 27.2.05 –.06 –.06— — —.44 .88 15.3100 200 300 500.90 1.3 1.8 2.03.8 5.0 6.0 7.330% D.E.R. 73270% D.E.R. 331% WTChange, Days7 28 1203.38 8.18 24.60— — —22.0 D —— — —.09 .19 .34.11 .27 .931.17 2.44 4.83100 200 300 5001.33 1.81 2.13 2.353. 4.88 — 6.2430% D.E.R. 73670% D.E.R. 331% WTChange, Days7 28 1202. 5.94 14.60— — —D — — — — —.07 .11 .27.07 .15 .591.16 2.38 4.86100 200 300 5001.15 1. 1.79 2.324.52 D — — ResinReagentSulfuric Acid 30%Nitric Acid 40%AcetoneTolueneSodium Hydroxide 50%JP 4 FuelDistilled WaterHRSThermal Degradation (% Wt. Loss) 160°C210°CD = Decomposed— = Not Determined1 For example Versamid 140 or Ancamide 350 A. (Curing agent is a 350-400 amine value polyamide.)†Typical values; not to be construed as specifications.Table25Physical Properties — DOW Liquid Epoxy Resins Containing a Reactive Diluent†ResinCuring AgentphrReactivity & Exothermof a 500 Gram Mass (@ 25°C)(Min.)1(°C)2(°C)3(Min.)4Heat DeflectionTemperature (°C)Flexural Strength (psi)6Flexural Modulus (psi x 105 )Yield CompressiveStrength (psi)Compressive Modulus(psi x 105 ) at 10% deformation or lessTensile Strength (psi)Ultimate Elongation (%)Glass Transition Temperature (°C)D.E.R. 324D.E.R. 325—D.E.H. 24—12.2 12.5D.E.R. 324D.E.R. 325—Polymide5—33 33D.E.R. 324D.E.R. 325—1,2-Cyclohexane Diamine—17 1741 3566 60230230483965 8816,400 4.57 11,800 19,2005.1114,300245 22550 5068 6826025050 6311,500 3.25 8,400 15,4004.3311,70086 6577 94240 250927581 9918,800 4.76 13,900 21,4005.0615,9002.58 9,000 8.70 3.0510,3006.372.14 6,700 7.32 2.858,7004.532.97 6,900 2.03 102 3.2411,8008.9512482 10267 881Time to transition point or gel.2Temperature at transition point.3Temperature at peak exotherm.4Time to peak exotherm.5For example Versamid 140 or Ancamide 350 A. (Curing agent is a 350-400 amine value polyamide.)6Sample size 1'' W x 1/8'' D; Span 2''.†Typical values; not to be construed as specifications.32Table26Electrical Properties — DOW Liquid Epoxy Resins Containing a Reactive Diluent†ResinCuring AgentDielectric Constant Cond. A Frequency, 1000 HzDissipation Factor Cond. A Frequency, 1000 Hz1 D.E.R. 324D.E.H. 24D.E.R. 325D.E.H. 24D.E.R. 324Polyamide1D.E.R. 325PolyamideD.E.R. 3241,2-Cyclohexane DiamineD.E.R. 3251,2-Cyclohexane Diamine3.994.183.3.683.914.21.014.0082.012.0090.0069.016For example Versamid 140 or Ancamide 350 A. (Curing agent is a 350-400 amine value polyamide.)†Typical values; not to be construed as specifications.TableResin27Chemical, Solvent Resistance, and Thermal Degradation —DOW Liquid Epoxy Resins Containing a Reactive Diluent†D.E.R. 324D.E.H. 24% WTChange, Days7 28 120.88 1.95 4.34.83 1.67 3.462.70 5.38 11.2.76 1.53 3.085.20 D D1.01 1.96 4.076.61 12.2 26.2.03 .04 .14.67 1.27 2.612.13 4.13 8.703.29 9.04 24.58.74 16.7 DD D D.49 .86 1.65100 200 300 500D.E.R. 325D.E.H. 24% WTChange, Days7 28 120.70 1.56 3.57.67 1.31 2.611.80 3.77 7.98.80 1.58 3.299.67 D D.88 1.74 3.794.37 8.43 18.3.03 .01 .16.45 .95 2.23.53 1.24 2.48.08 .14 .343.32 8.15 18.48.23 23.3 D.34 .77 1.58100 200 300 500D.E.R. 324Polyamide1% WTChange, Days7 28 120.46 1.13 2.35.68 1.28 2.143.45 6.48 13.6.69 1.32 2.244.82 D D.85 1.78 3.217.00 12.6 25.4.05 .03 .05.98 1.48 2.674.79 8.70 15.124.5 D D17.2 D DD D D.70 1.28 2.19100 200 300 500D.E.R. 325Polyamide% WTChange, Days7 28 120.29 .81 1.78.53 1.09 2.062.16 4.22 9.13.51 1.34 1.953.13 D D.66 1.32 2.634.14 7.65 15.3.06 .07 .06.67 1.33 2.362.09 3.84 7.337.66 17.8 25.110.2 D DD D D.58 1.01 1.98100 200 300 500D.E.R. 3241,2-Cyclohexane Diamine% WTChange, Days7 28 120.52 1.18 2.23.56 1.09 1.833.62 6.99 15.2.44 6.25 6.345.42 D D.77 1.58 2.877.41 13.3 27.6.05 .03 .20.60 1.09 1.662.69 5.38 11.53.98 12.1 39.615.2 D DD D D.50 .87 1.18100 200 300 500D.E.R. 3251,2-Cyclohexane Diamine% WTChange, Days7 28 120.49 1.01 1.96.61 1.13 1.902.55 5.17 11.1.41 2.18 1.8.38 D D.79 1.57 3.045.44 9.94 20.5.03 .09 .21.54 .98 1.68.41 1.56 4.13.15 .21 .584.82 D D15.9 D D.48 .84 1.31100 200 300 500Curing AgentReagentSulfuric Acid 30%Sulfuric Acid 3%Hydrochloric Acid 36%Hydrochloric Acid 10%Nitric Acid 40%Nitric Acid 10%Acetic Acid 25%Sodium Hydroxide 50%Ammonium Hydroxide 28%Ethanol 95%TolueneAcetoneEthylene DichlorideDistilled WaterHRSThermal Degradation (% Wt. Loss) 160°C210°C2.3 2.8 3.6 3.96.1 7.9 11.6 17.41.4 1.4 2.1 2.54.4 6.2 7.8 10.33.5 7.1 5.5 6.36.9 8.1 9.1 10.21.4 2.0 2.6 3.04.3 5.5 6.4 2.42.7 3.3 3.7 4.15.2 7.6 10.6 16.41.9 2.3 2.6 2..3 6.3 8.2 10.4D = Decomposed1 For example Versamid 140 or Ancamide 350 A. (Curing agent is a 350-400 amine value polyamide.)†Typical values; not to be construed as specifications.33ADDITIONALPROPERTYDATATableIn Table 28, D.E.R. 332 was selectedfor best color; D.E.R. 331 performssimilarly when blended with D.E.R.732 and cured with amino ethylpiperazine (AEP). Systems wereblended at 40°C, adding the chemical equivalent quantity of AEP.They were cured four hours at 60°C,and may also be cured at roomtemperature. Samples of one-eighthinch thickness were tested.28Physical Properties of D.E.R. 332 and D.E.R. 732Resins Cured with Amino Ethyl Piperazine100:025.07,0006.62Rigid0.480.87085:1523.58,2008.71Rigid0.610.85070:3021.56,6008.7<1Flex.0.821.20050:5019.52,100115<1Flex.1.231.940.8335:6517.530066<1Flex.1.723.002.00D.E.R. 332 and D.E.R. 732 (Ratio)D.E.H. 39Tensile Strength (psi)Ultimate Elongation (%)Color (Gardner)ConditionWt. Loss, 4 hr at 205°C (%)Wt. Loss, 8 hr at 205°C (%)Acetone Extraction (% – 2 hrs.)Table29Physical Properties of D.E.R. 331 and D.E.R. 732Resins Cured with D.E.H. 20100:011.012,2004.526,6003.77,5002.10.4390:1010.516,0004.032,0003.54,7001.90.4870:309.512,4003.432,9003.06,2002.50.7650:508.41,700†0.2916,7002.81,4000.202.00D.E.R. 331 and D.E.R. 732 (Ratio)D.E.H. 20 (phr)1Flexural Strength (psi)Flexural Modulus (x 105)Compressive Strength (psi)Compressive Modulus (x 105)Tensile Strength (psi)Tensile Modulus (x 105)Izod Impact Strength (ft. lbs./in. notch)1Cure Schedule: gel at room temp.; post cure 2 hrs. at 100°C.†Yielded, but did not break.Table3 0Physical Properties of D.E.R. 331 and D.E.R. 736Resins Cured with Nadic Methyl Anhydride100:086/56,3005.030,1004.53,3001.90.1690:1082/510,4005.331,4004.13,2002.00.1670:3075/513,4004.728,8004.13,3001.90.4450:5069/517,8004.626,7004.03,3002.00.38D.E.R. 331 and D.E.R. 736 (Ratio)Nadic Methyl AnhydrideFlexural Strength (psi)Flexural Modulus (x 105)Compressive Strength (psi)Compressive Modulus (x 105)Tensile Strength (psi)Tensile Modulus (x 105)Izod Impact Strength (ft. lbs./in. notch)1Cure Schedule: 4 hrs. at 80°C and 15 hrs. at 150°C. 34STORAGEThese comments are necessarily generaland abbreviated. More complete details are available in the technical brochures,DOW Epoxy Resins-Product Stewardship,Safe Handling and Storage Manual(FormNo. 296-00312) and DOW Epoxy CuringAgents-Product Stewardship, Safe Handlingand Storage Manual (Form No. 296-01331),available from your Dow sales representative.Each anticipated condition of elevatedtemperature storage should be checkedto determine its effect on the resin.Bulk StorageFor large consumers of epoxy resins,bulk storage of liquid resins is entirelyfeasible. Dow personnel, experienced inbulk storage and handling, are availableto assist you by making suggestionsregarding the design of storage and han-dling facilities.1Many bulk storage and handling details arediscussed in the two aforementioned technicalbrochures.1Liquid epoxy resins are stable for longperiods of time at room temperature.Diluent or solvent cut resins should bestored in tight containers to preventloss of the volatiles. A good practice isto store all resins and curing agents intight containers, because some are sus-ceptible to moisture absorption, whichmay affect rate of cure and other prop-erties. Moderate elevated temperaturestorage (50-55°C; 122-131°F) to reduceviscosity or prevent resin crystallizationhas little effect on most DOW resins,even after several months time. Storageat temperatures above 55°C is satisfac-tory for periods of two or three days for processing purposes. At these highertemperatures, some color and viscosityincrease occurs. The rate of increasedepends upon the temperature andvaries for different resins.35HAZARDS& HANDLINGPRECAUTIONSMaterial Safety Data sheets on D.E.R. and D.E.H. product types areavailable from Dow Plastics†to helpcustomers meet their handling anddisposal needs and applicable OSHArequirements.Because of the wide variety of materi-als used in epoxy resin systems, thefollowing discussion is only a generalguide. Also, because of the manyplant environments involved, no war-ranty of any kind can be given. Formore detailed information, formula-tors should contact the manufacturerof each material used. The Dow tech-nical brochures, DOW Epoxy ResinsProduct Stewardship Safe Handlingand Storage Manual, Form No. 296-00312 and DOW Epoxy CuringAgents Product Stewardship SafeHandling and Storage Manual, FormNo. 296-01331 can be helpful. Ask your Dow sales representativefor copies, or call the DowCustomer Information Group at1-800-441-4369 to request thesebrochures.Note: Dow recommends that its customersconduct a continuing training program forall personnel involved in epoxy handling,formulating, disposal, etc. Planning foremployee and plant safety has value onlywhen it is interpreted and practiced by thepeople involved.Curing AgentsCuring agents can be hazardous tohealth. For example, aliphatic amine-type materials are capable of causingserious irritation, even burns, dependingupon the degree of contact. In addition,they may cause a serious rash or anasthmatic-type response in sensitizedpersons. This response may developafter several weeks or months of contactwith the liquid or vapors that cause noimmediate apparent effects, or it mayresult from a single massive exposure.The aromatic amine curing agentsdiscussed in this bulletin are consideredto present a less acute hazard from skincontact than the aliphatic amine curingagents. For example, they are consider-ably less irritating to the skin, andalthough they may cause skin sensitiza-tion responses, they are less likely tothan the aliphatic amines. And becausethe aromatic amine curing agents areusually solids, they are considered topresent no significant acute vapor inhalation hazard, unless handled at elevated temperatures. Anhydride curing agents are considered to be capable of causingsevere eye and skin irritation, evenburns, depending upon the severity ofcontact. In addition, some of them maycause sensitization responses.Continued next pageHealth HazardsConsult the Specific ManufacturersMaterial Safety Data Sheet beforehandling any chemical.Liquid Epoxy ResinsSkinD.E.R. 317, D.E.R. 324, D.E.R. 325,D.E.R. 330, D.E.R. 331, D.E.R. 332,D.E.R. 337, D.E.R. 362, D.E.R. 3, andD.E.R. 383 epoxy resins are not acutelyirritating to the skin. However, theyare capable of causing skin sensitiza-tion. Susceptibility to skin irritationand sensitization varies from person to person. These epoxy resins, however,are considered to be milder skin sensi-tizers than amine-type curing agents orepoxy functional reactive diluents.InhalationVapor inhalation with most liquid resinsis not considered a problem unless theresins are heated. D.E.R. 333, D.E.R.343, and D.E.R. 345 resins are excep-tions: they contain xylene solvent witha TLV of 100 ppm (1997).Ingestion and Eye ContactAll of the liquid resins are low in acuteoral toxicity. Eye contact should resultin only slight, transient irritation. (Note:In the event of skin contact, thoroughlywash the affected area with copiousamounts of soap and water. Removecontaminated clothing and launderbefore reuse. In the event of eye con-tact, the eyes should be flushed withplenty of water. If eye or skin irritationpersists, seek qualified medical attention.)† Dow Plastics, a business group of The DowChemical Company and its subsidiaries.36HAZARDS& HANDLINGPRECAUTIONSPolyamide-type curing agents are distinctly less hazardous to handle than the other curing agents. They are considered to present a low degree of health hazard.Because of the differences in the catalytic-type curing agents suggestedfor use, no general statement can bemade as to the hazards involved intheir handling and use.Note: Specific information should berequested from the manufacturer of eachcuring agent prior to its use.Resin ModifiersThese materials vary greatly in theirchemical structure. Therefore, a generalstatement concerning their degree of haz-ard cannot be made. The epoxy-type com-pounds may be considered to present thesame degree of hazard as do the liquidepoxy resins. However, other reactivemodifiers may be more or less hazardousdepending upon the product. Consultyour supplier(s) prior to use.FillersFillers vary in their degree of hazard fromhandling. Some, such as the clays, may beconsidered essentially nonhazardous.However, dusts of glass, silica bearingpowders, and powdered metals may present a serious hazard from inhalationand/or explosion. Consult your supplier(s) prior to use.Reactive DiluentsBecause of their toxicological properties,the reactive diluents proposed for use areconsidered to present a high degree ofhazard. For example, they are capable ofcausing skin and eye irritation. They arealso capable of causing sensitizationresponses in a significant number of peo-ple who contact them. They may also pre-sent a significant hazard from inhalation.In short, they may be considered morehazardous than the liquid epoxy resins.Consult your supplier(s) prior to use.Cured ResinsResins that are completely polymerized(cured) are considered to be toxicological-ly inert. Therefore, they present no healthproblems from handling. However, dusts from machining castor molded parts may be an inhalationor explosion hazard.37HANDLINGPRECAUTIONSEach of these materials, when handledalone, may require special precautionsfor their safe handling. Consult withthe manufacturer of each productconcerning proper handling procedures prior to use. Resins systems, comprised of epoxyresins, curing agents, and other modi-fiers, require special precautions fortheir safe handling. Specific recommen-dations can only be made when specificconditions of handling are known.However, in general, resin systemsshould be handled so that allhuman contact is prevented. This can best be done by handling thematerials in an enclosed system. If thatis not feasible, the following guidelinesand precautions can be helpful in avoiding health problems.1.All personnel concerned with thehandling of these materials mustmaintain strict cleanliness of boththeir person and the area in whichthey work. There is no substitute forstrict cleanliness and housekeeping.2.Continued instruction of all employ-ees must be given concerning theconsequences of contact, as well asthe precautions necessary for safeoperations. Remember:•liquid epoxy resins may cause allergic sensitization and/or irritation.•avoid contact with eyes and skin.•avoid breathing vapors (especiallyof solvent containing systems).•do not take internally.3.Suitable protective clothing to preventcontact should be worn; the particu-lar type of clothing depends on theoperation. (Caution: Imperviousclothing can increase the hazard ifcontamination occurs on the inside.Do not wear or use contaminated arti-cles unless they have been thorough-ly decontaminated.)4.Contamination of the work areashould be minimized by placing cleandisposable paper on tables and bench-es. The paper should be renewedtwice daily or immediately followinggross contamination. (Note: Properdisposal of “disposables” is necessaryor they can be a source of contamina-tion to other workers.)5.Contact with the material can bereduced by the use of disposableutensils, such as paper dippers, containers, etc. See note in “4.”6.Contact with vapors should be prevented. Ventilation sufficient toremove all vapor at the point of use,and to assure fresh air supply, shouldbe provided.7.Isolate epoxy resin work areas fromother work areas to limit the directexposure of untrained workers andtheir exposure to contaminated toolsand equipment.Continued next page38HANDLINGPRECAUTIONSThe preceding comments are based onextensive experience and are expressedin good faith. We will work with customers-users to assist them in theproper use and handling of these materials. However, The Dow ChemicalCompany can accept no liability for operations not under its direct control.Responsibility for proper use, storage,and handling of these materials is that ofthe customer-user.Spill Containment and CleanupPersons engaged in spill cleanup shouldbe protected from vapors and from skincontact by wearing appropriate protectiveclothing and equipment.The immediate concern in any spill is toprotect personnel and to prevent a possi-ble fire hazard. Also, personnel engagedin spill cleanup should know proper dis-posal techniques in advance.For small spills of liquid or solutionepoxy resin (less than 5 gallons), applyan absorbent material or a high surface-area material such as sand to the spill,then shovel the mass into a suitable con-tainer. The residue on the floor or dockshould be removed with steam or hotsoapy water. (Note: Use of methylenechloride, acetone or aromatic solvents incleanup poses a distinct hazard andshould be avoided.) For solution resins,keep spark-producing equipment awayfrom the spill site. Also, if possible, shutoff or remove all potential sources ofignition.In the event of a larger spill (55 gallonsor more), employees should stay upwind. Evacuate and rope off the spillarea. Shut off leaks and all potentialsources of ignition. The spill should becontained with a dike, and excess resinshould be collected in suitable containersfor final disposal. Hot soapy water orsteam may be required for final cleanup. (Note: The use of solvents duringcleanup is hazardous and should beavoided.) Epoxy resins are often heated whenhandled in bulk. In spills of hot resin,care should be taken to avoid thermalburns.Liquid and solution resins should beprevented from entering sewers ordrains, or any body of water, includingrivers, streams or lakes. If spilled materialdoes enter drains or waterways, notifylocal authorities at once.FlammabilityAll D.E.R. epoxy resins are organicmaterials and will burn when sufficientheat and oxygen are supplied.A common measure of flammability isflash-point temperature (e.g.,see Table 1,page 4).This value indicates the mini-mum temperature at which flammableconditions are produced in controlledlaboratory experiments at atmosphericpressure.Note: Solvents, diluents, and other materialsused with epoxy resins commonly increase thehazard of flammability and/or explosion.Consult your supplier(s) prior to use.For Chemical Emergency(Spill, Leak, Fire, Exposure orAccident), call CHEMTREC,day or night, at 1-800-424-9300 in the U.S.In Canada, call CANUTEC at613-996-6666In Mexico, call SETIQ at 91-800-97-619Fires involving D.E.R. epoxy resins canbe extinguished with foam, dry powder,or carbon dioxide. Water is not normallyan effective extinguishing agent withthese resins.When burning, these resins give offtoxic byproducts, such as carbonmonoxide gas. Therefore, avoid breath-ing fumes, gases, or smoke resultingfrom a fire. Fire fighters should use anorganic vapor respirator or self-con-tained breathing apparatus.39APPENDIX—ABBREVIATIONSAEPBDMABGECGECPSDDS orDADSDDSADEAPADETADGEDICYEEWHDTHHPAMEAMEKMIBKMPDAMSDSMTHPAMWNMAPAPGEPHRTEPATETATHPA————————————————————————————Amino Ethyl PiperazineBenzyldimethylamineButyl Glycidyl EtherCresyl Glycidyl EtherCentipoise (viscosity);Cycles per Second (electrical)Diamino Diphenyl SulfoneDodecenyl Succinic AnhydrideDiethylaminopropylamineDiethylene TriamineDiglycidyl EtherDicyandiamideEpoxide Equivalent WeightHeat Distortion TemperatureHexahydrophthalic AnhydrideMonoethylamineMethyl Ethyl KetoneMethyl Isobutyl KetoneMetaphenylene DiamineMaterial Safety Data SheetMethyltetrahydrophthalic AnhydrideMolecular WeightNadic Methyl AnhydridePhthalic AnhydridePhenyl Glycidyl EtherParts per Hundred Parts Resin(by weight)Tetraethylene PentamineTriethylene TetramineTetrahydrophthalic Anhydride40PRODUCTSTEWARDSHIPDow encourages its customers andpotential users of Dow products to reviewtheir applications of such products fromthe standpoint of human health and envi-ronmental quality. When requested, Dowpersonnel will assist customers in dealingwith ecological and product safety consid-erations. Your Dow sales representativecan arrange the proper contacts. Dowproduct literature, including MaterialSafety Data sheets, should be consultedprior to the use of Dow products. Thesemay be obtained from your Dow salesrepresentative or sales office.The Dow Chemical Company has a fun-damental concern for all who make, dis-tribute, and use its products, and for theenvironment in which we live. The success of this Product Stewardship program rests with each and every individual involved with Dow products —from the initial concept and research tothe manufacture, sale, distribution, use,and disposal of each product.Internally, Dow’s Product Stewardshipprogram encompasses the education ofits employees in safe handling proce-dures, protective clothing and equipment,and the use of safety devices, such as eyewash fountains, and emergency showers.It involves monitoring of personnel forpotential vapor exposure, continuousmeasurement of area and effluent waterfor organic contaminants, and periodicmedical surveillance.Externally, the Product Stewardship program means helping in the educationof those who transport, unload, use, anddispose of a product. This is accom-plished through bulletins, pamphlets,product literature, correspondence, tele-phone contacts, seminars, and trainingprograms. In these and other programs,agendas may include discussion of theproduct hazards, suggested industrialhygiene practices, and suggested product handling practices. More detailed product stewardshipinformation is available in two productsafe handling and storage manuals: DOW Epoxy Resins Product Stewardship,Safe Handling and Storage Manual,Form No. 296-00312 and DOW EpoxyCuring Agents Product Stewardship,Safe Handling and Storage Manual,Form No. 296-01331.41For additional information in the U.S. and Canada, call theDow Customer Information Group at1-800-441-4369 or 1-517-832-1426 or cig@dow.com. In Mexico, call 95-800-441-4369.In Europe, contact the Dow Information Centrein The Netherlands at ++31-20-6916268 (phone),++31-20-69118 (fax) or dicinfo@euronet.nl (e-mail).In the Pacific area, callthe Dow Customer Service Center at81-120-024394 (toll-free in Japan) or81-3-5460-2114 (outside Japan).In Brazil, callthe Dow Chemical Service Center at 55 11 518367.NOTICE: No freedom from any patent owned by Seller or others is to be inferred. Because use conditions and applicable laws may differ from onelocation to another and may change with time, Customer is responsible for determining whether products and the information in this document areappropriate for Customer’s use and for ensuring that Customer’s workplace and disposal practices are in compliance with applicable laws and othergovernmental enactments. Seller assumes no obligation or liability for the information in this document. NO WARRANTIES ARE GIVEN; ALLIMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE ARE EXPRESSLY EXCLUDED.Published January 1999

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255/8138Printed in U.S.A.Form No. 296-00224-0199 WC+M