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专利名称：Processing apparatus and a processing
method
发明人：Osamu Hirose,Tetsuya Sada申请号：US09/046536申请日：19980324公开号：US06002572A公开日：19991214
摘要：The processing apparatus prevents difficulty in separation of the substratefrom the base because of charges on the substrate when the substrate is lifted from thebase for substrate placing during processing. The processing apparatus comprises pinsto lift up the substrate on the base and a neutralization apparatus to discharge ionizedgas to the gap between the bottom of the substrate lifted from the base by the pins andthe top of the base. When ionized gas is discharged to the substrate and the base, thecharges are neutralized.
申请人：TOKYO ELECTRON LIMITED
代理机构：Foley & Lardner
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