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专利名称：Solder bonding method and solder joint发明人：Ko Inaba,Tetsu Takemasa,Tadashi Kosuga申请号：US16277906申请日：20190215公开号：US11097379B2公开日：20210824
专利附图：
摘要：A solder bonding method that bonds, using a solder joint, an electrode of acircuit board to an electrode of an electronic component includes: depositing, on theelectrode of the circuit board, an Sn—Bi-based solder alloy with a lower melting pointthan a solder alloy deposited on the electrode of the electronic component; mountingthe electronic component on the circuit board such that the Sn—Bi-based solder alloycontacts the solder alloy on the electrode of the electronic component; heating thecircuit board to a peak temperature of heating of 150° C. to 180° C.; holding the peaktemperature of heating at a holding time of greater than 60 seconds and less than orequal to 150 seconds; and cooling, after the heating and to form the solder joint, thecircuit board at a cooling rate greater than or equal to 3° C./sec.
申请人：Lenovo (Singapore) Pte. Ltd.
地址：Singapore SG
国籍：SG
代理机构：Osha Bergman Watanabe & Burton LLP
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