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专利名称：Chip scale package for a micro component发明人：Jochen Kuhmann,Matthias Heschel申请号：US11202478申请日：20050811
公开号：US20070035001A1公开日：20070215
专利附图：
摘要：A package includes a sensor die with a micro component, such as a MEMSdevice, coupled to an integrated circuit which may include, for example, CMOS circuitry,and one or more electrically conductive bond pads near the periphery of the sensor die.A semiconductor cap structure is attached to the sensor die. The front side of the cap
structure is attached to the sensor die by a seal ring to hermetically encapsulate an areaof the sensor die where the micro component is located. The bond pads on the sensordie are located outside the area encapsulated by the seal ring. Electrical leads, whichextend along outer side edges of the semiconductor cap structure from its front side toits back side, are coupled to the micro component via the bond pads.
申请人：Jochen Kuhmann,Matthias Heschel
地址：Berlin DE,Rodovre DK
国籍：DE,DK
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