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专利名称：Modular interconnect system and apparatus发明人：James Friedhof申请号：US11786265申请日：20070410公开号：US07494384B2公开日：20090224
专利附图：
摘要：Systems and apparatuses are provided for placing interconnects or connectormodules into stacked arrangements, wherein individual interconnects or connectormodules can be readily accessed and repaired without disrupting the stackedarrangement. In one embodiment, the electrical connector system has a plurality of
interconnects mounted together in a stacked arrangement. Each of the interconnectscomprises a connector body and a backshell removably coupled to the connector body,wherein the backshell is configured to receive and retain a overbraid. Each backshell isdesigned to be uncoupled from the connector body while retaining the plurality ofinterconnects in the stacked arrangement, thereby making is possible to repair single ainterconnect without disrupting the others.
申请人：James Friedhof
地址：Hemet CA US
国籍：US
代理机构：O'Melveny & Myers LLP
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