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专利名称：Apparatus and method for thermoforming发明人：寺本 一典,仁平 政伸,宇佐美 秀樹申请号：JP2019081225申请日：20190422公开号：JP2019111836A公开日：20190711
专利附图：
摘要：Problem to be solved: to provide a heat forming apparatus and a heat formingmethod capable of effectively peeling the protective film from the sheet smoothly andpreventing the adhesion of foreign matter onto the adhesive surface of the sheet.Solution: base 22 holding substrate 10A heating plate (heating part) 3 having a heating
surface 3a for heating the sheet 4 andAndA sheet support 51 capable of winding andwinding the seat 4A sheet conveying portion 96 for supplying the sheet 4 to the heatingsurface 3a andA sheet gripping portion 58 for detachably holding the sheet end 4E of thesheet 4 supplied to the heating surface 3a andFilm winding portion 92 for removingprotective film 5 from sheet 4.The sheet conveying portion 96 is provided so as toreciprocate between the winding position P5 of the sheet end 4E and the supplycompletion position P6 along the extending direction of the heat plate 3.After the sheetconveying section 96 starts to move from the supply completion position P6 to thewinding position P5, winding of the protective film 5 is started in the film take-up section92.Diagram
申请人：株式会社浅野研究所
地址：愛知県愛知郡東郷町大字諸輪字北山１５８番地の２４７
国籍：JP
代理人：西澤 和純,川渕 健一,鈴木 史朗,石田 良平
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