Semiconductor package including heat spreader and

专利名称：Semiconductor package including heat

spreader and method for manufacturing thesame

发明人：Jae Choon Kim,Heejung Hwang,Eon Soo Jang申请号：US14976218申请日：20151221公开号：US09653373B2公开日：20170516

专利附图：

摘要：A semiconductor package includes a semiconductor chip on a packagesubstrate, a heat spreader on the semiconductor chip, a molding layer, an adhesive film

between the semiconductor chip and the heat spreader, and a through-hole passingthrough the heat spreader. The heat spreader includes a first surface and a secondsurface. The molding layer covers sidewalls of the semiconductor chip and the heatspreader and exposes the first surface of the heat spreader. The adhesive film is on thesecond surface of the heat spreader.

申请人：SAMSUNG ELECTRONICS CO., LTD.

地址：Suwon-si, Gyeonggi-Do KR

国籍：KR

代理机构：F. Chau & Associates, LLC

更多信息请下载全文后查看