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专利名称：Power module
发明人：Junji Fujino,Yoshihisa Uchida,Shohei
Ogawa,Soichi Sakamoto,TatsunoriYanagimoto
申请号：US15324085申请日：20151009公开号：US09818716B2公开日：20171114
专利附图：
摘要：A power module is fabricated, employing a clad metal that is formed bypressure-laminating aluminum and copper, in such a manner that the aluminum layer of
the clad metal is bonded such as by ultrasonic bonding to the surface electrode of thepower semiconductor chip and a wire is bonded to the copper layer thereof to establishelectrical circuit. The clad metal is thermally treated in advance at a temperature higherthan the operating temperature of the power semiconductor chip to sufficiently formintermetallic compounds at the interface between the aluminum layer and the copperlayer for the intermetallic compounds so as not to grow in thickness after the bondingprocesses.
申请人：MITSUBISHI ELECTRIC CORPORATION
地址：Chiyoda-ku, Tokyo JP
国籍：JP
代理机构：Buchanan Ingersoll & Rooney PC
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