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Method for forming a gate electrode having a metal

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专利内容由知识产权出版社提供

专利名称:Method for forming a gate electrode having

a metal

发明人:Olubunmi O. Adetutu,Lynne M.

Michaelson,Kathleen C. Yu,Robert E. Jones

申请号:US10827202申请日:20040419

公开号:US20050233562A1公开日:20051020

专利附图:

摘要:One embodiment forms a gate dielectric layer over a substrate and thenselectively deposits a first metal layer over portions of the gate dielectric layer in which a

first device type will be formed. A second metal layer, different from the first metal layer,is formed over exposed portions of the gate dielectric layer in which a second device typewill be formed. Each of the first and second device types will have different workfunctions because each will include a different metal in direct contact with the gatedielectric. In one embodiment, the selective deposition of the first metal layer isperformed by ALD and with the use of an inhibitor layer which is selectively formed overthe gate dielectric layer such that the first metal layer may be selectively deposited ononly those portions of the gate dielectric layer which are not covered by the inhibitorlayer.

申请人:Olubunmi O. Adetutu,Lynne M. Michaelson,Kathleen C. Yu,Robert E. Jones

地址:Austin TX US,Austin TX US,Austin TX US,Austin TX US

国籍:US,US,US,US

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