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专利名称：Apparatus and methods for cleaning and
drying of wafers
发明人：Boon Meng Seah,Bei Chao Zhang,Raymond
Joy,Shao Beng Law,John Sudijono,Liang ChooHsia
申请号：US11556696申请日：20061105公开号：US08177993B2公开日：20120515
专利附图：
摘要：An first example method and apparatus for etching and cleaning a substrate
comprises device with a first manifold and a second manifold. The first manifold has aplurality of nozzles for dispensing chemicals onto the substrate. The second manifold isattached to a vacuum source and/or a dry air/gas source. A second example embodimentis a wafer cleaning device and method that uses a manifold with capillary jet nozzles and aliquid capillary jet stream to clean substrates.
申请人：Boon Meng Seah,Bei Chao Zhang,Raymond Joy,Shao Beng Law,JohnSudijono,Liang Choo Hsia
地址：Singapore SG,Singapore SG,Singapore SG,Singapore SG,Singapore SG,SingaporeSG
国籍：SG,SG,SG,SG,SG,SG
代理机构：Horizon IP Pte Ltd
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