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CXA2075M

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CXA2075MRGB Encoder

Description

The CXA2075M is an encoder IC that convertsanalog RGB signals to a composite video signal.This IC has various pulse generators necessary forencoding. Composite video outputs and Y/C outputsfor the S terminal are obtained just by inputtingcomposite sync, subcarrier and analog RGB signals.It is best suited to image processing of personalcomputers and video games.

Compared to the CXA15M, the CXA2075M hassuperior points as follows:

1.The number of parts reduced (5 parts)Clamp capacitor

Regulator capacitor resistorResistor for filter

2.External parts reduced by the internal TRAP(External TRAP can be also selected)3.Higher band of R, G, B OUT

Features

•Single 5V power supply

•Compatible with both NTSC and PAL systems•Built-in 75Ωdrivers

(RGB output, composite video output, Y output, Coutput)

•Both sine wave and pulse can be input as asubcarrier.

•Built-in band-pass filter for the C signal and delayline for the Y signal

•Built-in R-Y and B-Y modulator circuits•Built-in PAL alternate circuit•Burst flag generator circuit•Half H killer circuit

Block Diagram and Pin Configuration

CVOUTROUTYTRAPGOUTGND2BOUTVcc2YOUTCOUTNCNCNC24 pin SOP (Plastic)

Applications

Video games and personal computersStructure

Bipolar silicon monolithic IC

Absolute Maximum Ratings

12V•Supply voltageVCC

•Operating temperatureTopr–20 to +75°C•Storage temperatureTstg–65 to +150°C•Allowable power dissipation

PD780mW

•Input pin applied voltage

RIN, GIN, BIN, SCIN, NPIN, SYNCIN and Vcc pinsvoltage or below, GND pin voltage or aboveRecommended Operating ConditionSupply voltageVCC1, 25.0 ±0.25

2423222120VIDEO OUT19181716151413TRAPSWITCHINTERNAL TRAPDELAYSYNC ADDR-OUTG-OUTB-OUTY/C MIX75DRIVER75DRIVERBPFR-YModulatorREGULATORB-YModulatorPHASESHIFTER8PULSEGEN9101112MATRIXLPFLPFCLAMPSIN-PULSE1234567GINBFOUTRINNCSYNCINGND1NPINBINNCSony reserves the right to change products and specifications without prior notice. This information does not convey any license byany implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating theoperation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

SCIN– 1–

Vcc1NCE96X23

CXA2075M

Pin DescriptionPinNo.SymbolPin voltageEquivalent circuitDescriptionGround for all circuits other than RGB,composite video and Y/C output circuits.The leads to GND2 should be as short andwide as possible.VCC1100Ω1GND10V—234RINGINBINBlack levelwhenclamped100Ω234175µ175µGND1ICLP5NCVCC1350µ2VAnalog RGB signal inputs. Input at100% = 1Vp-p (max.). To minimize clamperror, input at as low impedance aspossible.ICLPturns ON only in the burst flag period.NO CONNECTION6SCIN—610P40k2.5V100µGND1Subcarrier input.Input 0.4 to 5.0Vp-p sine wave or pulse.Refer to Notes on Operation, Nos. 2 and 4.VCC180k68k73k7NPIN1.7Vwhen openPin for switching between NTSC and PALmodes.NTSC: VCC, PAL: GND32kGND1VCC18008BFOUTH : 3.6VL: 3.2V81.6kBFpulse monitoring output. Incapable ofdriving a 75Ωload.65µGND165µ– 2–

CXA2075M

PinNo.9SymbolPin voltageNCEquivalent circuitDescriptionNO CONNECTIONVCC140k10SYNCIN2.2V104kComposite sync signal input. Input TTL-level voltages.L ( ≤0.8V): SYNC periodH ( ≥2.0V)2.2VGND11112NCVcc15.0V—NO CONNECTIONPower supply for all circuits other thanRGB, composite video and Y/C outputcircuits.Refer to Notes on Operation, Nos. 3 and 8.NO CONNECTIONNO CONNECTION1314NCNC20Ω375µVcc2Vcc115COUT1.6V152.8V2.2kGND1GND2Chroma signal output. Capable of driving a75Ωload.Refer to Notes on Operation, Nos. 5 and 7.20Ω375µVcc2Vcc116YOUTBlack level1.35VY signal output. Capable of driving a 75Ωload.Refer to Notes on Operation, Nos. 5 and 7.GND1GND2162.8V2.2k– 3–

CXA2075M

PinNo.SymbolPin voltageEquivalent circuitDescriptionPin for reducing cross color caused by thesubcarrier frequency component of the Ysignal. When the CVOUT pin is in use,connect a capacitor or a capacitor and aninductor in series between YTRAP andGND. Decide capacitance and inductance,giving consideration to cross color and therequired resolution.No influence on the YOUT pin.Internal TRAP can be also used.Refer to Notes on Operation, No. 6.100ΩVcc1Y17YTRAPBlack level2.13V1730k1.5k100µGND118NCNO CONNECTIONPower supply for RGB, composite videoand Y/C output circuits. Decouple this pinwith a large capacitor of 10µF or above asa high current flows.Refer to Notes on Operation, Nos. 3 and 8.19VCC25.0V—20Ω375µVcc2Vcc120CVOUTBlack level0.97VComposite video signal output. Capable ofdriving a 75Ωload.Refer to Notes on Operation, Nos. 5 and 7.GND1GND2202.8V2.2k20Ω375µVcc2Vcc1212223BOUTGOUTROUTBlack level1.2V2122232.8V2.2kGND1GND2Analog RGB signal outputs. Capable ofdriving a 75Ωload.Refer to Notes on Operation, Nos. 5 and 7.24GND20V—Ground for RGB, composite video and Y/Coutput circuits. The leads to GND1 shouldbe as short and wide as possible.– 4–

CXA2075M

Electrical Characteristics(Ta = 25°C, VCC = 5V, See the Electrical Characteristics Measurement Circuit.)

S1S2S3S4MeasurementconditionsNo input signal,SG5: CSYNCTTL level,SG4: SIN wave3.58MHz0.5Vp-pFig. 1Min.Typ.Max.UnitMeasure-RINSYNCment pinGINSCINNPININBINICC12.75VSG45VSG5ItemSymbolCurrentconsumption 1Currentconsumption 2(R, G, BOUT)ICC1—67—mAICC2ICC2—40—VO (R)RGB output voltageVO(G)VO (B)fC(R)RGB outputfrequencycharacteristicsfC(G)fC(B)(YOUT)Output sync levelR100%: Y levelG100%: Y levelB100%: Y levelWhite 100%: Y levelVO(YS1/2)VO(YR1/2)SG1SG2SG3SG1SG2SG32V2VDEFDEFSG1 to SG3:DC direct coupling 3.2VDC,1.0Vp-pf = 200kHzPin 9 = Clamp voltage∗Fig. 2SG1 to SG3:DC direct coupling 3.2VDC,1.0Vp-pf = 27MHz/200kHzPin 9 = Clamp voltageFig. 30.0.690.72V–5–5–5–3.2–3.4–3.8———dBdBdBSG10VVO(YG1/2)toSG3VO(YB1/2)VO(YW1/2)SG1to0VSG35VSG5BSG1 to SG3:100% color barinput,1.0Vp-p (Max.)SG5: CSYNCTTL levelFig. 4SG1 to SG3:DC direct coupling 3.2VDC,1.0Vp-pf = 5MHz/200kHzPin 9 = Clamp voltage0.240.190.380.060.630.270.2150.4050.0760.6820.310.240.430.090.79Vp-pOutput frequencycharacteristicsfC(Y1/2)5V2V–1–0.13—dB(CVOUT)Output sync levelR100%: Y levelG100%: Y levelB100%: Y levelWhite 100%: Y levelVO(YS1/2)VO(YR1/2)SG10VVO(YG1/2)toSG3VO(YB1/2)VO(YW1/2)SG1to0VSG3SG1 to SG3:100% color barinput,1.0Vp-p (Max.)SG5: CSYNCTTL levelFig. 4SG1 to SG3:DC direct coupling 3.2VDC,1.0Vp-pf = 5MHz/200kHzPin 9 = Clamp voltage0.220.180.350.0550.610.240.2080.3760.0710.660.270.230.410.0850.75Vp-pVVVV5VSG5COutput frequencycharacteristicsfC(Y1/2)5V2V–3.3–1.53—dB∗Clamp voltage: voltage appearing at Pin 9 when CSYNC is input.

– 5–

CXA2075M

Item

Symbol

S2S3S4

Measurementconditions

Min.

Typ.

Max.

Unit

Measure-RIN

SYNCment pinGINSCINNPININBIN

(COUT)Burst levelR chroma ratioR phaseG chroma ratioG phaseB chroma ratioB phaseBurst widthBurst position

VO(BN1/2)R/BN1/2θR1/2G/BN1/2θG1/2B/BN1/2θB1/2

SG1

toSG4SG3

SG1 to SG3:100% color barinput,

1.0Vp-p (Max.)SG4:SIN wave,

3.58MHz0.5Vp-p

SG5:CSYNC

TTL levelFig. 5

0.242.92.72321.83412.350.35

SG1 to SG3:

No signal,

SG4:SIN wave,

3.58MHz0.5Vp-p

SG5:CSYNC

TTL level

3.58MHz component measured. Fig. 6

0.2823.171043.062382.13482.60.68

0.343.61113.82462.353562.80.95

degµsµsdegdegVp-p

5VSG5

tW(B) 1/2tD(B) 1/2

Carrier leakVL1/2

SG1

toSG4SG3

5VSG5—629mVp-p

– 6–

CXA2075M

Item

Symbol

S2S3S4

Measurementconditions

Min.

Typ.

Max.

Unit

Measure-RIN

SYNCment pinGINSCINNPININBIN

(CVOUT)Burst levelR chroma ratioR phaseG chroma ratioG phaseB chroma ratioB phaseBurst widthBurst position

VO(BN1/2)R/BN1/2θR1/2G/BN1/2θG1/2B/BN1/2θB1/2

SG1

toSG4SG3

SG1 to SG3:100% color barinput,

1.0Vp-p (Max.)SG4:SIN wave,

3.58MHz0.5Vp-p

SG5:CSYNC

TTL levelFig. 5

0.222.95992.92331.83422.350.35

SG1

toSG4SG3

SG1 to SG3:

No signal,

SG4:SIN wave,

3.58MHz0.5Vp-p

SG5:CSYNC

TTL level

3.58MHz component measured. Fig. 6SG1 to SG3:

No signal,

SG4:SIN wave,

4.43MHz0.5Vp-p

SG5:CSYNC

TTL levelFig. 6SG1 to SG3:

DC direct coupling 3.2VDC1.0Vp-pf = 3.58MHz/200kHzYTRAP = 3.32k

0.23.31053.232392.023492.520.66

0.323.71113.52472.33572.80.95

degµsµsdegdegVp-p

5VSG5

tW(B) 1/2tD(B) 1/2

Carrier leak

VL1/25VSG5—629mVp-p

PAL burstlevel ratio

K (BP1/2)θPAL1/2

SG1

toSG4GNDSG5SG3

0.9129214

1.0138221

1.1146228

degdeg

PAL burst phase

θXPAL1/2

Internal TRAPattenuationfrequency

fTRAP

SG1

to0VSG3

5V2VC–30–21.6–4dB

– 7–

Electrical Characteristics Measurement Circuit47µD220µ75BOUT21VIDEO OUTTRAPSWITCH75DRIVER75DRIVERINTERNAL TRAPDELAYBPFR-YModulatorREGULATORLPFB-YModulatorSYNC ADDB-OUTY/C MIX2019181715161413CVOUTVcc2NCS5YOUTCOUTNCNC7575YTRAP0.01µIcc23.32kopen5V220µ220µ75CBA5V757575220µF75220µE75220µ757575GND2ROUTGOUT242322R-OUTG-OUTCLAMPSIN-PULSEMATRIX– 8–

LPFPHASESHIFTER8NPINS3BFOUTPHASESHIFTER9NC104BINS10.1µSG3S2NCSCIN5675V2VPALNTSCSG4SIN0.5Vp-p12311SYNCINS4NC12Vcc10.01µ47µSG5CSYNCIcc15VCXA2075M

GND1RINGINS1S10.1µ0.1µ2.75VSG1SG2CXA2075M

Measuring Signals and Output Waveforms

SG4

0.5Vp-pSCINSG5SYNC

µs4.5µsf = 3.58MHz2.0V0.8V

SG5SYNC

INSG1RINSG2GINSG3BIN

SG1 to 3

RINGINBINDEF point

ROUTGOUTBOUT

VO2.5V1.0Vp-pBC pointYOUTCVOUT

Vo (YB)Vo (YW)Vo (YG)Vo (YR)Vo (YS)µs4.5µs10µs1.0Vp-p2.0V0.8VFig. 1

1.0Vp-p1.0Vp-pf = 200kHz

Fig. 4

Fig. 2

SG4

0.5Vp-pSCIN

f = 3.58MHz

SG1 to 3

RINGINBINDEFBC pointROUTGOUTBOUTYOUTCVOUT

2.5V1.0Vp-pSG5SYNCINµs4.5µs10µs2.0V0.8V

f = 200kHz/27MHz

SG1RINSG2GINSG3BINVO

fc = 20log

Vo (27MHz)Vo (200kHz)

1.0Vp-pFig. 3

1.0Vp-p1.0Vp-pSG4

0.5Vp-pSCIN

f = 3.58MHz/ 4.43MHz

SG4SYNCINC pointCVOUTVo (BN)A pointCOUTVLK (BP) =Vo (BN)

Vo (BN)Vo (BN)

µs4.5µsVo (BN)VLVo (BN)

tW (B)2.0V0.8V

A pointCOUTVO (BN)C pointCVOUTtD (B)VO (BN)VO (CG)VO (CB)VO (CR)tW (B)B/BN =R/BN =G/BN =

VO (CR)VO (BN)VO (CG)VO (BN)VO (CB)VO (BN)

VO (CB)VO (CG)VO (CR)Fig. 5

Fig. 6

– 9–

CXA2075M

Application Circuit (NTSC internal TRAP mode)

47µ220µ220µ75GND22423ROUT22220µ75GOUT21220µ7524043BOUT20VIDEO OUTR-OUTG-OUTB-OUTY/C MIX0.01µCVOUT19Vcc2NC1817∗ 3.32k/1%forNTSC220µ75YTRAP16220µ75YOUT15COUTNC14NC13Vcc+5V

Application Circuit (NTSC external TRAP mode)

47µ220µ220µ75GND22423ROUT22220µ75GOUT21220µ7524043BOUT20VIDEO OUTR-OUTG-OUTB-OUTY/C MIX0.01µCVOUT19Vcc2NC1817220µ75YTRAP16220µ75YOUT15COUTNC14NC13Vcc+5V

TRAPSWITCHINTERNAL TRAPDELAYSYNC ADD75DRIVER75DRIVERBPFR-YModulatorREGULATORB-YModulatorPHASESHIFTER8PHASESHIFTER9NC10SYNCIN11NC0.01µ12Vcc147µMATRIXLPFLPFCLAMPSIN-PULSE1GND12RIN0.1µ3GIN0.1µ4BIN0.1µ5NC6SCIN7NPINBFOUTApplication circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility forany problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.

– 10–

CXA2075M

Application Circuit (PAL internal TRAP mode)

47µ220µ220µ75GND22423ROUT22220µ75GOUT21220µ7524043BOUT20VIDEO OUTR-OUTG-OUTB-OUTY/C MIX0.01µCVOUT19Vcc2NC1817∗ 2.61k/1%forPAL220µ75YTRAP16220µ75YOUT15COUTNC14NC13Vcc+5V

Application Circuit (PAL external TRAP mode)

47µ220µ220µ75GND22423ROUT22220µ75GOUT21220µ75240BOUT4320VIDEO OUTR-OUTG-OUTB-OUTY/C MIX0.01µCVOUT19Vcc2NC1817220µ75YTRAP16220µ75YOUT15COUTNC14NC13Vcc+5V

– 11–

CXA2075M

Description of Operation

Analog RGB signals input from Pins 2, 3 and 4 are clamped in the clamping circuit and output from Pins 23,22 and 21, respectively.

The matrix circuit performs operations on each input signal, generating luminance signal Y and colordifference signals R-Y and B-Y. The Y signal enters the delay line to adjust delay time with the chroma signalC. Then, after addition of the CSYNC signal input from Pin 10, the Y signal is output from Pin 16.

A subcarrier input from Pin 6 is input to the phase shifter, where its phase is sfited 90°. Then, the subcarrieris input to the modulators and modulated by the R-Y signal and the B-Y signal. The modulated subcarriers aremixed, sent to the band-pass filter to eliminate higher harmonic components and finally output from Pin 15 asthe C signal. At the same time, Y and C signals are mixed and output from Pin 20 as the composite videosignal.

Burst Signal

The CXA2075M generates burst signals at the timing shown below according to the composite sync signalinput.

H synchronization

SYNCIN(TTL level)

tD (B)tW (B)C VIDEOOUT

Burst signalCOUT

tD (B)tW (B)

V synchronization

ODD

SYNCIN

EVEN

ODD

C VIDEOOUT

EVEN

Burst signalSynchronizing signal

– 12–

CXA2075M

Notes on Operation

Be careful of the following when using the CXA2075M.

1.Be sure that analog RGB signals are input at 1.0Vp-p maximum and have low enough impedance. High

impedance may affect color saturation, hue, etc. Inputting RGB signals in excess of 1.3Vp-p may disablethe clamp operation.2.The SC input (Pin 6) can be either a sine wave or a pulse in the range from 0.4 to 5.0Vp-p.

However, when a pulse is input, its phase may be shifted several degrees from that of the sine wave input.In the IC, the SC input is biased to 1/2 VCC. Accordingly, when a 5.0Vp-p pulse is input and the duty factordeviates from 50%, High- and Low-level pulse voltages may exceed VCCand GND in the IC, which causessubcarrier distortion. In such a case, be very careful that the duty factor keeps to 50%.3.When designing a printed circuit board pattern, pay careful attention to the routing of the VCCand GND

leads. To decouple the VCCpin, use tantalum, ceramic or other capacitors with good frequencycharacteristics. Ground the capacitors by connections shown below as closely to each IC pin as possible.Try to design the leads as short and wide as possible.

VCC1... GND1VCC2... GND2

Design the pattern so that VCCis connected to GND via a capacitor at the shortest distance.

4.SC and SYNC input pulses

Attach a resistor and a capacitor to eliminate high-frequency components of SC (Fig. A) and SYNC (Fig. B)before input.

2.2k5P2.2k47PFig. AFig. B

Be careful not to input pulses containing high-frequency components. Otherwise, high-frequencycomponents may flow into VCC, GND and peripheral parts, resulting in malfunctions.

5.Connecting an external resistor to the 75Ωdriver output pin

A capacitance of several dozen picofarads at each pin may start oscillation. To prevent oscillation, designthe pattern so that a 75Ωresistor is mounted near the pin (see Fig. C).

∗75

∗ Make these leads short.

∗Fig. C

When any of the 75Ωdriver output pins is not in use, leave it unconnected and design the pattern so thatno parasitic capacitance is generated on the printed circuit board.

– 13–

CXA2075M

6.YTRAP pin (Pin 17)

There are the following three means of reducing cross color generated by subcarrier frequency componentscontained in the Y signal.

(1)Install a capacitor of 30 to 68pF between YTRAP and GND. Decide the capacitance by conducting image

evaluation, etc., giving consideration to both cross color and resolution.Relations between capacitance and picture quality are as follows:

CapacitanceCross colorResolution

30pF ←→68pFLarge ←→SmallHigh ←→Low

17C

(2)

Connect a capacitor C and an inductor L in series between YTRAP and GND. When the subcarrier

frequency is f0, the values C and L are determined by the equation f0= . Decide the values in2π√LCimage evaluation, etc., giving consideration to both cross color and resolution.Relations between inductor values and picture quality are as follows:Inductor valueCross colorResolution

Small ←→LargeLarge ←→SmallHigh ←→Low

17CL

For instance, L = 68µH and C = 28pF are recommended for NTSC. It is necessary to select an inductor Lwith a sufficiently small DC resistance. Method (2) is more useful for achieving a higher resoluation thanmethod (1). When an even higher resolution is necessary, use of the S terminal (YOUT and COUT) isrecommended.(3)

TRAP built in the IC can be used. Connect a resistor which determines to between YTRAP (Pin 17) andVcc. Refer to Application Circuit. Be very careful of frequency characteristics and picture quality, and thenuse them.

17NTSC modePAL modeR = 3.32kΩR = 2.61kΩ

RVcc

7.Driving COUT (Pin 15), YOUT (Pin 16), CVOUT (Pin 20), and B.G.R OUT (Pins 21, 22 and 23) outputs

In Pin Description, \"Capable of driving a 75Ωload\" means that the pin can drive a capacitor +75Ω+75Ωload shown in the figure below. In other words, the pin is capable of driving a 150Ωload in AC.

75ΩPIN75Ω

220µF8.This IC employs a number of 75Ωdriver pins, so oscillation is likely to occur when measures described in

Nos. 3 and 5 are not taken thoroughly. Be very careful of oscillation in printed circuit board design andcarry out thorough investigations in the actual driving condition.

– 14–

CXA2075M

Package OutlineUnit: mm

24PIN SOP (PLASTIC)

+ 0.415.0 – 0.1

+ 0.41.85 – 0.150.15+ 0.35.3 – 0.17.9 ± 0.4+ 0.20.1 – 0.050.45 ± 0.11.27

+ 0.10.2 – 0.05± 0.12MPACKAGE STRUCTURE

MOLDING COMPOUND

SONY CODEEIAJ CODEJEDEC CODE

SOP-24P-L01∗SOP024-P-0300-A

LEAD TREATMENTLEAD MATERIALPACKAGE WEIGHT

EPOXY/PHENOL RESINSOLDER PLATING

COPPER ALLOY / 42ALLOY

0.3g

– 15–

0.5 ± 0.2112

6.9

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