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专利名称：Conformal sealing and interplanar
encapsulation of electronic device structures
发明人：Ameen, Joseph George,Buchwalter, Stephen
Leslie,Kovac, Caroline Ann,Palmer, MichaelJon,Poore, Paige Adams
申请号：EP1076.8申请日：190412公开号：EP0340492A2公开日：191108
专利附图：
摘要：Electronic device packaging structures wherein the active face (6) of anelectronic device (4) is mounted facing a substrate (12). Environmental isolation isprovided by an overcoat polymeric material (44) at least sealing the space (41) betweenthe device and substrate at the periphery of the device. Enhanced environmental isolationis provided by a polymeric material disposed to substantially fill the space (41) betweenthe device and substrate. The overcoat polymeric material provides enhanced fatigue life
to solder mounds disposed between and electrically interconnecting the device andsubstrate.
申请人：International Business Machines Corporation
地址：Old Orchard Road Armonk, N.Y. 10504 US
国籍：US
代理机构：Klocke, Peter, Dipl.-Ing.
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