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专利名称：APPARATUS AND PROCESS FOR PRECISE
ENCAPSULATION OF FLIP CHIPINTERCONNECTS
发明人：PENDSE, REJENDRA申请号：EP02703379申请日：20020225公开号：EP1461823A4公开日：20090923
摘要：A method including applying resin (30) to an integrated circuit chip (18), and anapparatus including a reservoir (20).
申请人：CHIPPAC, INC.
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