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专利名称：Temperature stabilized integrated circuits发明人：George Stennis Moore申请号：US114754申请日：20060629
公开号：US200800017A1公开日：20080103
专利附图：
摘要：Temperature stabilization of an integrated circuit to reduce effects of data andactivity variation. Heat dissipating load structures are integrated onto the die andcontrolled in response to sensed device characteristics. In a first embodiment, heatdissipating load structures on the device are used to maintain constant device power
dissipation. In a second embodiment, the heat dissipating load structures are used inconjunction with on-device temperature sensors to maintain constant devicetemperature.
申请人：George Stennis Moore
地址：Veradale WA US
国籍：US
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