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专利名称：Efficient application management in a cloud
with failures
发明人：Theophilus Benson,Yaoping Ruan,Sambit
Sahu,Anees A. Shaikh
申请号：US13437467申请日：20120402公开号：US082945B2公开日：20141118
专利附图：
摘要：A semiconductor device includes a first layer, first and second active areasdisposed on the first layer; a trench disposed between the first and second active areas,
an insulating oxide that fills the trench to a level below a surface of the first and secondactive layers, and a nitride cap disposed on top of the insulating oxide so that the firstand second active areas can be cleaned without damaging the insulating oxide. A topsurface of the nitride cap in regions adjacent to the first and second active areas inaligned with a top surface of the first and second active areas, a top surface of the nitridecap in a center region of the nitride cap is stepped below the top surface of the adjacentregions, and a void is formed between the top surface regions adjacent to the first andsecond active areas.
申请人：Theophilus Benson,Yaoping Ruan,Sambit Sahu,Anees A. Shaikh
地址：Madison WI US,Yorktown Heights NY US,Yorktown Heights NY US,YorktownHeights NY US
国籍：US,US,US,US
代理机构：F. Chau & Associates, LLC
代理人：Louis J. Percello, Esq.
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