Package, method for producing a package and a devi

专利名称：Package, method for producing a package

and a device for producing a package

发明人：Johan Maier,Karl Kronegger,Gottfried

Reiter,Harald Kraushaar

申请号：US11204428申请日：20050815

公开号：US20060038286A1公开日：20060223

专利附图：

摘要：The invention relates to a package or package raw material comprising anelectrically conductive layer arranged on a base material and a chip connected to the

electrically conductive layer, the electrically conductive layer being configured as anantenna element for transferring data and/or energy, wherein the electrically conductivelayer comprises a non-conductive portion. Further, the invention relates to a method forproducing a package and a device for producing a package.

申请人：Johan Maier,Karl Kronegger,Gottfried Reiter,Harald Kraushaar

地址：Elixhausen AT,Ebensee AT,Adnet AT,Salzberg AT

国籍：AT,AT,AT,AT

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