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HD74LS27P资料

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HD74LS27

Triple 3-input Positive NOR Gates

REJ03D0403–0200

Rev.2.00 Feb.18.2005

Features

• Ordering Information

Part Name

Package Type

Package Code (Previous Code) PRDP0014AB-B (DP-14AV) PRSP0014DF-B (FP-14DAV)

Package

Abbreviation

Taping Abbreviation (Quantity)

HD74LS27P DILP-14 pin HD74LS27FPEL

SOP-14 pin (JEITA)

P — FP

EL (2,000 pcs/reel)

Note: Please consult the sales office for the above package availability.

Pin Arrangement

1A1B2A2B2C2YGND1234567141312111098VCC1C1Y3C3B3A3Y(Top view)

Rev.2.00, Feb.18.2005, page 1 of 4

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HD74LS27

Circuit Schematic (1/3)

VCC20kInputsA20kB20k1.5kCGND 3k4.5kOutputY8k75

Absolute Maximum Ratings

Supply voltage Input voltage

Power dissipation Storage temperature

Item Symbol Ratings Unit VCC 7 V VIN 7 V PT 400 mW Tstg –65 to +150 °C

Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.

Recommended Operating Conditions

Item Symbol Min Typ Max Unit Supply voltage VCC 4.75 5.00 5.25 V IOH — — –400 µA

Output current

IOL — — 8 mA Operating temperature Topr –20 25 75 °C

Rev.2.00, Feb.18.2005, page 2 of 4

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HD74LS27

Electrical Characteristics

(Ta = –20 to +75 °C)

Item

Input voltage

Symbol min. typ.* max. Unit Condition VIH 2.0 — — V VIL — — 0.8 V VOH 2.7 — — V VCC = 4.75 V, VIL = 0.8 V, IOH = –400 µA

— — 0.4 IOL = 4 mA

V VCC = 4.75 V, VIH = 2 V VOL

— — 0.5 IOL = 8 mA

IIH — — 20 µA VCC = 5.25 V, VI = 2.7 V IIL — — –0.4 mA VCC = 5.25 V, VI = 0.4 V

— 0.1 mA VCC = 5.25 V, VI = 7 V II — — –100 mA VCC = 5.25 V IOS –20 ICCH — 2.0 4.0 mA VCC = 5.25 V

ICCL — 3.4 6.8 mA VCC = 5.25 V

Output voltage

Input current Short-circuit output

current Supply current

Input clamp voltage VIK — — –1.5 V VCC = 4.75 V, IIN = –18 mA Note: * VCC = 5 V, Ta = 25°C

Switching Characteristics

(VCC = 5 V, Ta = 25°C)

Item Symbol min. typ. max. Unit Condition tPLH — 10 15 ns Propagation delay time CL = 15 pF, RL = 2 kΩ

tPHL — 10 15 ns Note: Refer to Test Circuit and Waveform of the Common Item \"TTL Common Matter (Document No.: REJ27D0005-0100)\".

Rev.2.00, Feb.18.2005, page 3 of 4

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HD74LS27

Package Dimensions

JEITA Package CodeP-DIP14-6.3x19.2-2.54RENESAS CodePRDP0014AB-BPrevious CodeDP-14AVMASS[Typ.]0.97gD1481b 37ZEReferenceSymbolDimension in MillimetersMinNom7.6219.26.320.327.45.060.510.400.481.300.190°2.292.540.250.3115°2.792.392.540.56MaxAA 1e1DELAA1bpeb pθe1cb3cθeZ( Ni/Pd/Au plating )L

JEITA Package CodeP-SOP14-5.5x10.06-1.27RENESAS CodePRSP0014DF-BPrevious CodeFP-14DAVMASS[Typ.]0.23g*1D8FNOTE)1. DIMENSIONS\"*1 (Nom)\"AND\"*2\"DO NOT INCLUDE MOLD FLASH.2. DIMENSION\"*3\"DOES NOTINCLUDE TRIM OFFSET.14bpHEEIndex mark*2cReferenceSymbolDimension in MillimetersMinNom10.065.50Max10.5Terminal cross section ( Ni/Pd/Au plating )1Ze*3DEA2A10.007b pxML10.100.202.20Abpb1cc10.340.400.460.150.200.25AθHE0°7.507.801.278°8.00θA 1yLexy0.120.151.420.501Detail FZLL0.701.150.90

Rev.2.00, Feb.18.2005, page 4 of 4

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Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan1.Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that troublemay occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.Notes regarding these materials1.These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer'sapplication; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.2.Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.3.All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time ofpublication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It istherefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest productinformation before purchasing a product listed herein.The information described here may contain technical inaccuracies or typographical errors.Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductorhome page (http://www.renesas.com).4.When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure toevaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumesno responsibility for any damage, liability or other loss resulting from the information contained herein.5.Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human lifeis potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of aproduct contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeateruse.6.The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.7.If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government andcannot be imported into a country other than the approved destination.Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.8.Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.Keep safety first in your circuit designs!RENESAS SALES OFFICESRefer to \"http://www.renesas.com/en/network\" for the latest and detailed information.http://www.renesas.comRenesas Technology America, Inc.450 Holger Way, San Jose, CA 95134-1368, U.S.ATel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe LimitedDukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd.10th Floor, No.99, Fushing North Road, Taipei, TaiwanTel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd.Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, ChinaTel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd.1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001

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