RD65FVRD65FVRectifier DiodeTarget Information
Replaces November 2000, version DS5408-1.1
DS5408-2.0 October 2001
FEATURES
sss
KEY PARAMETERSVRRMIF(AV)IFSM
(max)(max)
600V11745A162000A
Optimised For High Current RectifiersHigh Surge CapabilityVery Low On-state Voltage
APPLICATIONS
sss
ElectroplatingPower SuppliesWelding
VOLTAGE RATINGS
Part and OrderingRepetitive Peak
NumberReverse Voltage
VRRMVRD65FV06RD65FV05RD65FV04RD65FV03RD65FV02RD65FV01600500400300200100Conditions
VRSM = VRRM
Outline type code: V(See Package Details for further information)Fig. 1 Package outline
ORDERING INFORMATION
When ordering, select the required part number shown in theVoltage Ratings selection table.For example:RD65FV04
Note: Please use the complete part number when ordering andquote this number in any future correspondance relating to yourorder.
1/7
www.dynexsemi.com
元器件交易网www.cecb2b.com
RD65FV
CURRENT RATINGS
Tcase = 75oC unless otherwise statedSymbol
Double Side CooledIF(AV)IF(RMS)IF
Mean forward currentRMS value
Continuous (direct) forward current
Half wave resistive load
--117451845016974
AAA
Parameter
Conditions
Max.
Units
Single Side Cooled (Anode side)IF(AV)IF(RMS)IF
Mean forward currentRMS value
Continuous (direct) forward current
Half wave resistive load
--76321198810079
AAA
Tcase = 85oC unless otherwise statedSymbol
Double Side Cooled
IF(AV)IF(RMS)IF
Mean forward currentRMS value
Continuous (direct) forward current
Half wave resistive load
--111201750016000
AAA
Parameter
Test Conditions
Max.
Units
Single Side CooledIF(AV)IF(RMS)IF
Mean forward currentRMS value
Continuous (direct) forward current
Half wave resistive load
--7200113009450
AAA
2/7
www.dynexsemi.com
元器件交易网www.cecb2b.com
RD65FV
SURGE RATINGS
SymbolIFSMI2tIFSMI2t
Parameter
Surge (non-repetitive) forward currentI2t for fusing
Surge (non-repetitive) forward currentI2t for fusing
Test Conditions10ms half sine, Tcase = 175˚CVR = 50% VRRM - 1/4 sine10ms half sine, Tcase = 175˚C
VR = 0
Max.13084.5 x 106
162132 x 106
UnitskAA2skAA2s
THERMAL AND MECHANICAL RATINGS
SymbolRth(j-c)
Parameter
Thermal resistance - junction to case
Test Conditions
Double side cooledSingle side cooled
DCAnode DCCathode DC
Rth(c-h)
Thermal resistance - case to heatsink
Clamping force 43.0kN
Double side
Min.-------–5538.7
Max.0.00750.0150.0150.0020.00422520020047.3
Units˚CW˚CW˚CW˚CW˚CW˚C˚C˚CkN
(with mounting compound)Single side
Tvj
Virtual junction temperature
Forward (conducting)Reverse (blocking)
TstgFm
Storage temperature rangeClamping force
CHARACTERISTICS
SymbolIRMIrrQSVTOrT
Parameter
Peak reverse current
Peak reverse recovery currentTotal stored chargeThreshold voltageSlope resistance
Test Conditions
At VRRM, Tcase = 200˚CIF = 2000A, dIRR/dt = 3A/µs,Tcase = 200˚C, VR = 100VAt Tvj = 200˚CAt Tvj = 200˚C
Min.-----Max.150230390.60.0225
UnitsmAAµCVmΩ
3/7
www.dynexsemi.com
元器件交易网www.cecb2b.com
RD65FV
CURVES
8000700016000Tj = 200˚C14000120001000080006000400020000Instantaneous forward current, IF - (A) dc1/2 wave 3 phase 6 phase 5000400030002000100000.5Mean power dissipation - (W) 60000.550.60.650.70.75Instantaneous forward voltage, VF - (V)0.802000400060008000100001200014000Mean forward current, IF(AV) - (A)Fig. 2 Maximum (limit) forward characteristicsFig. 3 Power dissipation10000IFQS1000Conditions:Tj = 200˚CVR = 100VIF = 2000AMax. IRR100Reverse recovery current IRR - (A)Stored charge QS - (µC)dI/dtIRM1000Max. QS1000.11.01010100Rate of decay of forward current dI/dt - (A/µs)Fig. 4 Maximum stored charge and reverse recovery current vs dI/dt4/7
www.dynexsemi.com
元器件交易网www.cecb2b.com
RD65FV
2800.1I2t = Î2 x t 2100Anode side cooledThermal impedance - ˚C/WPeak half sine forward current - (kA)24020080I2t value - (A2s x 106)0.01Double side cooled16060120400.0018020401ms1012351020500.00010.001ConductionEffective thermal resistanceJunction to case ˚C/WDouble sideAnode side0.00750.015d.c.0.00850.016Halfwave0.00920.01673 phase 120˚0.01200.01946 phase 60˚0.010.11.0Time - (s)10100Cycles at 50HzDurationFig. 6 Maximum (limit) transient thermal impedanceFig. 5 Surge (non-repetitive) forward current vs time(with 50% VRRM @ Tcase = 175˚C)
5/7
www.dynexsemi.com
元器件交易网www.cecb2b.com
RD65FV
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unlessstated otherwise. DO NOT SCALE.
Holes Ø3.6 x 2.0 deep (In both electrodes)CathodeØ112.5 maxØ73 nomØ73 nomAnodeNominal weight: 1100gClamping force: 43kN ±10%Package outine type code: VNote:
1. Package maybe supplied with pins and/or tags.
6/7
27.025.4www.dynexsemi.com
元器件交易网www.cecb2b.com
RD65FV
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and currentcapability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. TheAssembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of ourcustomers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loadedclamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mmClamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performanceor our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or CustomerServices.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONSDYNEX SEMICONDUCTOR LTDDoddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.Tel: 00-44-(0)1522-500500Fax: 00-44-(0)1522-500550DYNEX POWER INC.99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9Tel: 613.723.7035Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.Advance Information: The product design is complete and final characterisation for volume production is well in hand.No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded asa representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reservesthe right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that suchmethods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publicationor data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.© Dynex Semiconductor 2001 Publication No. DS5408-2 Issue No. 2.0 October 2001TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM7/7
www.dynexsemi.com
因篇幅问题不能全部显示，请点此查看更多更全内容