OPTOINTERRUPTERFeatures
▪Non-contactswitching.
▪FordirectPCboardordual-in-linesocketmounting.▪Fastswitchingspeed.
Application
▪Scanner
▪Edge,PositionDetections▪FAXmachine▪Counter
Description
TheTP806seriesconsistofGalliumArsenideinfraredemittingdiodeandaNPNsilliconphototransistormountedinablackplastichousing.Phototransistorswitchingtakesplacewheneveranopaqueobjectpassesthroughtheslot.TheseseriesaredesignedfordirectsolderingintoPCboardormountinginstandarddual-in-linesocket.
Switchingtimemeasurementcircuit
SIVAGOSEMICONDUCTORCO.,LTD.
OPTOINTERRUPTERDATASHEETPACKAGEDIMENSIONS
NOTES:
1.Alldimensionsareinmillimeters(inches).
2.Toleranceis±0.25mm(.010\")unlessotherwisenoted.
3.Leadspacingismeasuredwheretheleadsemergefromthepackage.PartNo.:TP806DATASHEET
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SIVAGOSEMICONDUCTORCO.,LTD.
OPTOINTERRUPTERDATASHEETABSOLUTEMAXIMUMRATINGSATTA=25℃
PARAMETER
IRDiodeContinuousForwardCurrentIRDiodeReverseVoltageTransistorCollectorCurrantTransistorPowerDissipationIRDiodePeakPowerCurrant(PulseWide=1μS,300pps)DiodePowerDissipation
PhototransistorCollector-EmitterVoltagePhototransistorEmitter-CollectorVoltageOperatingTemperatureRangeStorageTemperatureRange
MAXIMUMRATING
505201003175305
-40℃to+85℃-50℃to+100℃
UNITmAVmAmWAmWVV
PartNo.:TP806DATASHEETpage2of6
SIVAGOSEMICONDUCTORCO.,LTD.
OPTOINTERRUPTERDATASHEETELECTRICALOPTICALCHARACTERISTICSATTA=25℃
PARAMETER
INPUTLEDForwardVoltageReverseCurrent
OUTPUTPHOTOTRANSISTORCollector-Emitter
BreakdownVoltageEmitter-Collector
BreakdownVoltageCollector-Emitter
DarkCurrentCOUPLERCollector-Emitter
SaturationVoltageCurrentTransferRatio
VCE(SAT)
0.4
0.8
VmA
IC=0.2mAIF=20mAVCE=5VIF=20mA
V(BR)CEOV(BR)CEOICEO305
100
VVnA
IC=1mAIE=0.1mAVCE=10V
VFIR
1.2
1.35100
VμA
IF=20mAVR=5V
SYMBOL
MIN.
TYP.
MAX.UNIT
TESTCONDITION
Ic(on)
PartNo.:TP806DATASHEETpage3of6
SIVAGOSEMICONDUCTORCO.,LTD.
OPTOINTERRUPTERDATASHEETTYPICALELECTRICAL/OPTICALCHARACTERISTICSCURVES
(25℃AmbientTemperatureUnlessOtherwiseNoted)
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SIVAGOSEMICONDUCTORCO.,LTD.
OPTOINTERRUPTERDATASHEETPackingQuantitySpecification1.200Pcs/1Bag,8Bag/1Box2.4Boxes/1CartonLabelFormSpecification
‧PRODUCT:PartNumber
‧CODENO.:ProductSerialNumber‧QTY:PackingQuantity‧LOTNo:LotNumber‧REMARKS:Remarks
NotesLeadForming
1.Duringleadframebending,theleadframeshouldbebentatadistancemorethan3mmfrombottomoftheepoxy.
Note:MustfixleadframeanddonottouchepoxybeforebendingtoavoidPhotoInterrupterbroken.
2.Leadformingshouldbedonebeforesoldering.
3.AvoidstressingthePhotoInterrupterpackageduringleadsforming.ThestresstothebasemaydamagethecharacteristicsofPhotoInterrupter,oritmaybreakthePhotoInterrupter.4.CutthePhotoInterrupterleadframeatroomtemperature.CuttingtheleadframeathightemperaturesmaycausefailureofthePhotoInterrupter.
5.WhenmountingthePhotoInterrupterontoaPCB,thePCBholesmustbealignedexactlywiththeleadpositionofthePhotoInterrupter.IfthePhotoInterrupteraremountedwithstressatTheleads,itcausesdeteriorationoftheepoxyresinandthiswilldegradethePhotoInterrupter.
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OPTOINTERRUPTERDATASHEETSoldering
1.Carefulattentionshouldbepaidduringsoldering.Whensoldering,leavemorethan3mmfromsolderjointtoepoxybulb,andsolderingbeyondthebaseofthetiebarisrecommended.
2.Recommendedsolderingconditions:
HandSoldering
Temp.attipofironSolderingtimeDistancejointtoepoxybulb)300°CMax.(30WMax.)3secMax.3mmMin.(FromsolderDistancetoepoxybulb)Preheattemp.Bathtemp.&timeDIPSoldering
100°CMax.(60secMax.)260Max.,5secMax3mmMin.(Fromsolderjoint3.Recommendedsolderingprofile
4.AvoidingapplyinganystresstotheleadframewhilethePhotoInterrupterareathightemperatureparticularlywhensoldering.
5.Dipandhandsolderingshouldnotbedonemorethanonetime
6.AftersolderingthePhotoInterrupter,theepoxybulbshouldbeprotectedfrommechanicalshockorvibrationuntilthePhotoInterrupterreturntoroomtemperature.
7.Arapid-rateprocessisnotrecommendedforcoolingthePhotoInterrupterdownfromthepeaktemperature.
8.Althoughtherecommendedsolderingconditionsarespecifiedintheabovetable,diporhandsolderingatthelowestpossibletemperatureisdesirableforthePhotoInterrupter.
9.Wavesolderingparametermustbesetandmaintainaccordingtorecommendedtemperatureanddwelltimeinthesolderwave.PartNo.:TP806DATASHEET
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