专利内容由知识产权出版社提供
专利名称：COPPER ALLOY
发明人：Minoru UDA,Takahiro ISHIKAWA,Taiji
MIZUTA,Yasunari MIZUTA,HiroyasuTANIGUCHI
申请号：US14749745申请日：20150625
公开号：US20160312340A1公开日：20161027
摘要：The copper alloy of the present invention contains 5% by mass to 25% by massof Ni, 5% by mass to 10% by mass of Sn, 0.005% by mass to 0.5% by mass of element. A(element A being at least one selected from the group consisting of Mb, Zr and Ti), and0.005% by mass or more of carbon. In the copper alloy, the mole ratio of the carbon tothe element A is 10.0 or less. The copper alloy may further contain 0.01% by mass to 1%by mass of Mn. In this copper alloy, the element A may be present as carbide.
申请人：NGK Insulators, Ltd.,Osaka Alloying Works, Co., Ltd.
地址：Nagoya-City JP,Fukui-City JP
国籍：JP,JP
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