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专利名称：METHOD AND DEVICE FOR INJECTION-MOLDING THERMOPLASTIC RESIN FORMEDPRODUCT
发明人：KAWAUCHI, Hitoshi Sekisui Chemical Co.
Ltd.,,HARADA, Hiroshi Sekisui Chemical Co.Ltd.,HIRANO, Hiroyuki Sekisui Chemical Co.Ltd.,SHIMURA, Satoshi Sekisui Chemical Co.Ltd.
申请号：EP00956953.4申请日：20000906公开号：EP12879B1公开日：20061129
摘要：An object of the invention is to provide an injection molding process for
preparing thermoplastic resin molded articles and an injection molding apparatus for usein practicing this process, the process and the apparatus being adapted to supply ablowing agent, especially a nonreactive gas such as carbon dioxide or nitrogen gas, to athermoplastic resin continuously at a relatively low pressure with good stability toincorporate the agent or gas into the resin. As shown in FIG. 3, a resin in a cylinder (2) ofan injection molding machine (1) as melted by rotating a screw (3) is mixed and dissolvescarbon dioxide which is supplied to the molten resin from a gas supply opening (5)formed in the screw (3). An amount of the gas-incorporating molten resin is measuredout and injected into a mold cavity to obtain an expansion-molded article. To incorporatecarbon dioxide into the molten resin, the gas is supplied from a gas inlet (11) formed in a
rear end portion of the screw to a portion (4a) not fed with the resin and positionedbetween front and rear screw flights and closer to the front flight, through a gas supplychannel 6 extending through the screw and via the supply opening (5).
申请人：SEKISUI CHEMICAL CO LTD
地址：JP
国籍：JP
代理机构：Wagner, Bernhard Peter
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