专利内容由知识产权出版社提供
专利名称：Apparatus for disconnecting solder joints
between two welded surfaces
发明人：Qin Ping Zhao,Shen Kuang Sidney Chou申请号：US13570324申请日：20120809公开号：US08872061B2公开日：20141028
专利附图：
摘要：An apparatus for disconnecting solder joints between two welded surfacesincludes a laser device for emitting laser beams to a solder joint, and a solder materialremoval device. And the solder material removal device includes a nozzle device having a
first passage, a holder holding the nozzle device and having a second passage
communicated with the first passage, and at least two pumping devices connected to theholder to pump the melted solder material out from the nozzle device and the holder.The laser device and the solder material removal device are separated, a glass cover witha hole formed thereon is covered on the top of the holder, and the laser device islocated above the glass cover and separated from the holder. The present invention canshorten maintenance time and maintenance workload and improve work efficiency,furthermore reduce and stabilize the laser energy.
申请人：Qin Ping Zhao,Shen Kuang Sidney Chou
地址：DongGuan CN,Hong Kong CN
国籍：CN,CN
代理机构：Nixon & Vanderhye PC
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