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Single chip power amplifier and envelope modulator

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专利名称:Single chip power amplifier and envelope

modulator

发明人:Per-Olof Brandt,Jonas Persson申请号:US10869987申请日:20040617

公开号:US200501221A1公开日:20050609

专利附图:

摘要:RF polar modulation circuit has a self-compensated temperature stableenvelope controller and self-compensated temperature stable power amplifier bias. Thecircuit has an adaptive current-to-voltage modulation interface with pre-distortion

compensation capability. AM/PM distortion are compensated for envelope dependentpower amplifier transistor biasing. Automatic compensation is provided for RF loads thatare higher or lower than nominal loads. This Abstract is provided to comply with rulesrequiring an Abstract that allows a searcher or other reader to quickly ascertain subjectmatter of the technical disclosure. This Abstract is submitted with the understanding thatit will not be used to interpret or limit the scope or meaning of the claims.

申请人:Per-Olof Brandt,Jonas Persson

地址:Lomma SE,Lund SE

国籍:SE,SE

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