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专利名称：Method for producing an integrated circuit
with a rewiring device and correspondingintegrated circuit
发明人：Harry Hedler,Roland Irsigler,Thorsten
Meyer
申请号：US10721745申请日：20031126公开号：US070749B2公开日：20060711
专利附图：
摘要：The present invention provides a method for producing an integrated circuit
with a rewiring device. In the method, there is provision of a carrier device with definedcutouts, application of at least one integrated circuit upside down to the carrier devicesuch that the defined cutouts of the carrier device are located above at least oneconnection device of the integrated circuit application of an insulation device to that sideof the carrier device which is not covered by the integrated circuit, omitting the at leastone connection device in the cutout); application of the patterned rewiring device to theinsulation device; application of a patterned solder resist device to the patterned rewiringdevice; and patterned application of solder balls on sections of the rewiring device whichare not covered by the patterned solder resist device. The present invention likewiseprovides such an apparatus.
申请人：Harry Hedler,Roland Irsigler,Thorsten Meyer
地址：Germering DE,München DE,Dresden DE
国籍：DE,DE,DE
代理机构：Morrison & Foerster LLP
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