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专利名称：Board for additive circuits
发明人：Tadao Shimizu,Noriyuki Shimizu,Shoji Harada申请号：US06/493269申请日：19830510公开号：US04524098A公开日：19850618
摘要：There is provided a board for additive circuits which is formed with pluralconvexo-concave irregularities on the surface of an inorganic composite plate wherein aneedle-like or fiber-like inorganic material is present as a mixture with an isotropic solidvitreous inorganic material while maintaining its needle-like or fiber-like form.
申请人：NIKKAN INDUSTRIES CO., LTD.
代理机构：Cushman, Darby & Cushman
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