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Circuit board and method of making

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专利名称:Circuit board and method of making发明人:BAUR, PETER,DR., DIPL.-ING.,KAZMIERCZAK,

HARALD, DIPL.-PHYS.

申请号:EP96104392.4申请日:19960320公开号:EP0765110B1公开日:19990602

摘要:The board has a multilayer structure with an underlying carrier board (12) ofglass-fibre-reinforced epoxy resin and two superimposed high-current boards (14,16)separated by insulating adhesive film (26). Conductive tracks (20) on both sides of thecarrier interconnect low-current electronic components (24) on its underside. Holes aredrilled through the boards for pluggable contacts (38) with the carrier. The conductivetrack structure (28) on the high-current boards themselves is provided preferably bystamping out of sheet metal or foil.

申请人:ROBERT BOSCH GMBH,BOSCH GMBH ROBERT,ROBERT BOSCH GMBH

地址:DE

国籍:DE

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